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Kevin Chiang

Observed name: K. Chiang
OpenAlex ID: A5110196279
Electrical characterization and structure investigation of quad flat non-lead package for RFIC applications
2002 · Nansen Chen, Kevin Chiang, et al. · Solid-State Electronics · 28
Comparative Analysis of Electrical Performance on Coreless and Standard Flip-Chip Substrate
2007 · Robert Sung, Kevin Chiang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 21
Electrical analyses of TSV-RDL-bump of interposers for high-speed 3D IC integration
2012 · Tseshih Sung, Kevin Chiang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 11
Electrical characterization of quad flat non-lead package for RFIC applications
2002 · Nansen Chen, K. Chiang, et al. · International Semiconductor Device Research Symposium · 6
Electrical characterization of through silicon via (TSV) for high-speed memory application
2008 · Terry Hsu, Kevin Chiang, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 5
High-speed electrical design study for 3D-IC packaging technology
2011 · Robert Sung, Kevin Chiang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 3
RF modeling of ball grid array packages using a coupled transmission line model
2003 · Yeong-Lin Lai, Chia-Long Wu, et al. · Digest of papers - IEEE Radio Frequency Integrated Circuits Symposium · 3
Controlled S-Parameters on Multi-Layer Package
2003 · Nansen Chen, Kevin Chiang, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 2
Advanced integrated passive device (IPD) low pass filter designs on WLCSP
2009 · Po-Hao Chang, Kevin Chiang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 1
DDRII Memory Packages Electrical Performance Comparison of COSBGA, TFBGA, and Standard TSOPII
2005 · Bryan Hsieh, Kevin Chiang, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 1
RFICs packages electrical performance comparison of both ULTRA-CSP and Standard TSOP
2003 · T. Hsu, K. Chiang, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1
A novel decoupling capacitor for power integrity application in high-speed 3D-IC package system
2013 · Robert Sung, Steve Hu, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
EMI improvement study on advanced package design
2010 · Robert Sung, Kevin Chiang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Guarding trace and ground via-hole analysis for DDR interface designed in high-speed packages
2009 · Robert Sung, Kevin Chiang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
A High Performance Leadframe Design For Memory Application
2008 · Hsing-da Kao, Kevin Chiang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Time Delay Control Methodology for High Speed Substrate Design
2008 · Po-Hao Chang, Bryan Hsieh, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Common mode signal pairs improvement design in high speed application
2007 · Po-Hao Chang, Kevin Chiang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Works count: 17
Citation count: 82
H-index: 5
I10-index: 3
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