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Haruo Tabata
Observed names:
H. Tabata,
HARUO TABATA,
Haruo TABATA
Observed institutions:
ROHM,
Nitto (Japan),
Nitto (United States)
OpenAlex ID:
A5110242948
Internal stress of epoxy resin modified with acrylic core‐shell particles prepared by seeded emulsion polymerization
1986
·
Yoshinobu Nakamura
, Haruo Tabata
, et al.
·
Journal of Applied Polymer Science
·
96
Low-Stress Resin Encapsulants for Semiconductor Devices
1985
·
K. Kuwata
, K. Iko
, et al.
·
IEEE Transactions on Components Hybrids and Manufacturing Technology
·
55
Internal stress of epoxy resin modified with acrylic core-shell particles containing functional groups prepared by seeded emulsion polymerization
1987
·
Yoshinobu Nakamura
, Haruo Tabata
, et al.
·
Journal of Applied Polymer Science
·
37
New Profile of Ultra Low Stress Resin Encapsulants for Large Chip Semiconductor Devices
1987
·
Y. Nakamura
, S. Uenishi
, et al.
·
IEEE Transactions on Components Hybrids and Manufacturing Technology
·
30
Degradation of Brominated Epoxy Resin and Effects on Integrated-Circuit-Device Wirebonds
1989
·
M. Nakao
, T. Nishioka
, et al.
·
ACS symposium series
·
15
Stress Analysis of the Silicon Chip-Plastic Encapsulant Interface
1987
·
S. Oizumi
, N. Imamura
, et al.
·
ACS symposium series
·
7
Screen Printing Grade Polyimide Paste for Alpha-Particle Protection
1986
·
K. Yamaguchi
, K. Igarashi
, et al.
·
IEEE Transactions on Components Hybrids and Manufacturing Technology
·
4
Special Properties of Molding Compounds for Small-Outline Packaged Devices
1986
·
S. Ito
, Y. Uhara
, et al.
·
IEEE Transactions on Components Hybrids and Manufacturing Technology
·
4
Effects of mechanical and flow properties of encapsulating resin on the performance of ultra thin tape carrier package
2002
·
Y. Nakamura
, M. Ohta
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
3
Adhesion in the Field of Semiconductor Packaging
2011
·
Haruo TABATA
·
Journal of The Adhesion Society of Japan
·
1
PDF
Adhesion in Electronics Jisso (Packaging)
2010
·
Haruo TABATA
·
JOURNAL OF THE JAPAN WELDING SOCIETY
·
1
PDF
Special Issue. Surface Finishing for Electronics Parts. The Influence of Adhesive Property of Epoxy Molding Compound to Reliability of Semiconductor Devices.
1993
·
Haruo TABATA
·
Journal of The Surface Finishing Society of Japan
·
1
PDF
Intention to the Special Edition
2007
·
Haruo TABATA
·
Journal of The Japan Institute of Electronics Packaging
PDF
Untitled
2006
·
HARUO TABATA
·
Journal of The Japan Institute of Electronics Packaging
PDF
20 Stress Analysis of Silicon Chip and Plastic
1986
·
Hideto SUZUKI
, H. Tabata
, et al.
Vinyl Polymerization Intiated with Substituted Azophenylethanes
1980
·
Bunichiro Yamada
, H. Tabata
, et al.
·
Memoirs of the Faculty of Engineering, Osaka City University
The Construction and Motion Characteristics of the Telecommunication Relay Float
1974
·
Haruo Tabata
, Masaolshida Tabata
, et al.
·
Offshore Technology Conference
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Works count:
17
Citation count:
254
H-index:
6
I10-index:
5
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