Author

Tobias Bernhard

Observed names: Bernhard, Tobias, Tobias Bernhard (corresponding author)

Institution: Atotech (Germany)

Observed institution: Atotech (Germany)

OpenAlex ID: A5110517341

Improvements of the Epoxy–Copper Adhesion for Microelectronic Applications

2019 · Lérys Granado, Stefan Kempa, et al. · ACS Applied Electronic Materials · 38

Properties of electroless Cu films optimized for horizontal plating as a function of deposit thickness

2015 · Tanu Sharma, Ralf Brüning, et al. · Microelectronic Engineering · 27

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The effect of Ni on the kinetics of electroless Cu film deposition

2017 · Eric Logan, Tanu Sharma, et al. · Thin Solid Films · 21

Nickel dependence of hydrogen generation, hydrogen co-deposition and film stress in an electroless copper process

2018 · Tanu Sharma, Alexandre E. Landry, et al. · Thin Solid Films · 18

Stress of electroless copper deposits on insulating and metal substrates

2014 · Ralf Brüning, Allison Sibley, et al. · Thin Solid Films · 16

The Impact of Hydrogen Gas Evolution on Blister Formation in Electroless Cu Films

2015 · Tobias Bernhard, Frank Brüning, et al. · Journal of Microelectronics and Electronic Packaging · 12

A metal oxide adhesion layer prepared with water based coating solution for wet Cu metallization of glass interposer

2015 · Zhiming Liu, Sara Hunegnaw, et al. · IMAPSource Proceedings · 11

Analysis of stress/strain in Electroless Copper Films

2013 · Tobias Bernhard, Simon Bamberg, et al. · IMAPSource Proceedings · 8

Properties of an electroless copper process as a function of nickel and cyanide ion concentrations

2021 · Delilah A. Brown, Alex R. MacDonald, et al. · Journal of Applied Electrochemistry · 6

Microstructure of combined electroless and galvanic deposits on roll annealed copper foils and copper single crystals

2020 · Maryam Abbasi, Delilah A. Brown, et al. · Thin Solid Films · 6

Nickel dependence of hydrogen co-deposition and nanoporosity in electrolessly deposited Cu-films

2020 · Tobias Bernhard, Edith Steinhauser, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6

Determination of Energy Release Rate Through Sequential Crack Extension

2017 · Scott McCann, Gregory T. Ostrowicki, et al. · Journal of Electronic Packaging · 6

Challenges of Adhesion Promotion for the Metallization of Glass Interposers

2013 · Simon Bamberg, Michael Merschy, et al. · IMAPSource Proceedings · 5

Main Impact Factors on Internal Stress of Electroless Deposited Copper Films

2015 · Tobias Bernhard, Sebastian Zarwell, et al. · IMAPSource Proceedings · 4

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The Impact of Hydrogen Gas Evolution on Blister Formation in Electroless Copper Films

2014 · Tobias Bernhard, Frank Brüning, et al. · IMAPSource Proceedings · 4

Effect of Ni on Electroless Cu Plating Rates in the Presence of 2,2′-Bipyridyl and 2-Mercaptobenzothiazole

2023 · Gavin S. Lindsay, Dirk Rohde, et al. · Journal of The Electrochemical Society · 3

Facet type determination based on combined atomic force microscopy and electron backscatter diffraction

2023 · Ralf Brüning, Mehrad Hajati, et al. · Journal of Microscopy · 3

The Effect of Cu Target Pad Roughness and Solution Flow on the Growth Mode and Void Formation in Electroless Cu Films

2021 · Tobias Bernhard, Sebastian Zarwell, et al. · Journal of Microelectronics and Electronic Packaging · 3

The Effect of Cu Target Pad Roughness on the Growth Mode and Void Formation in Electroless Cu Films

2019 · Tobias Bernhard, Sebastian Zarwell, et al. · International Wafer Level Packaging Conference (IWLPC) · 3

Crystal facets and surface morphology as a function of crystal orientation by automatic alignment of AFM and EBSD data: application to etched copper polycrystals

2025 · Ralf Brüning, Sawyer Stanley, et al. · Journal of Materials Science · 2

A Predictive Metallographic Means to Identify The Relative Risk of Failure for Plated Micro Vias

2023 · Tobias Bernhard, Roger Massey, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2

In-Situ Stress Determination of Electroless Cu on PCB-Relevant Substrates

2018 · Tobias Bernhard, Ralf Bruning, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2

Strain in Electroless Copper Films: Analysis by in situ X-Ray Diffraction and Curvature Methods

2013 · Simon Bamberg, Tobias Bernhard (corresponding author), et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2

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Relation between surface morphology, facet selection, and crystal orientation in electroless copper deposits on polycrystalline copper substrates

2026 · Ralf Brüning, Abhijit Singh, et al. · Thin Solid Films · 1

Correction: Crystal facets and surface morphology as a function of crystal orientation by automatic alignment of AFM and EBSD data: application to etched copper polycrystals

2025 · Ralf Brüning, Sawyer Stanley, et al. · Journal of Materials Science · 1

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Works count: 33

Citation count: 213

H-index: 8

I10-index: 7