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Yiu-Ming Cheung

Observed names: Y M Cheung, Y. M Cheung, Y. M. Cheung, Y.M. Cheung, YiuMing Cheung
Observed institution: ASM Pacific Technology (China)
OpenAlex ID: A5110570468
Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging
2018 · John H. Lau, Ming Li, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 100
Fan-Out Wafer-Level Packaging for Heterogeneous Integration
2018 · John H. Lau, Ming Li, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 94
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
2018 · Cheng-Ta Ko, Henry Yang, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 55
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
2018 · Cheng-Ta Ko, Chieh-Lin Chang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 36
A high throughput and reliable thermal compression bonding process for advanced interconnections
2015 · Ming Li, DeWen Tian, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 18
New proposed adhesive tape application mechanism for stacking die applications
2003 · Y.M. Cheung, A.C.M. Chong · International Conference on Electronic Packaging Technology (ICEPT) · 15
Finite element stress analysis of thin die detachment process
2003 · A.C.M. Chong, Y.M. Cheung · International Conference on Electronic Packaging Technology (ICEPT) · 13
Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)
2017 · John Lau, Ming Li, et al. · IMAPSource Proceedings · 10
Investigation of key factors in thermal compression (TCB) NCF bonding process
2015 · Lei Yang, Dewen Tian, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 9
Feasibility Study of Fan-Out Panel-Level Packaging for Heterogeneous Integrations
2019 · Cheng-Ta Ko, Henry Yang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 8
Longitudinal strain response of a 0.9PMN–0.1PT multilayer actuator
2002 · K.W. Tang, H.L.W. Chan, et al. · Materials Chemistry and Physics · 6
Process considerations of TC-NCP fine-pitch copper pillar FC bonding
2012 · Y.M. Cheung, Ka San Lam, et al. · International Conference on Electronic Materials and Packaging · 5
Pros and cons of laser C2 reflow process by high power diode laser
2014 · Y. M. Cheung, Zetao Ma, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 4
Investigation into transient characteristics of post-welding shift for opto-electronic pigtail package
2005 · C.H. Yiu, Y.M. Cheung · IEEE Electronic Components and Technology Conference (ECTC) · 3
Transient characteristics of post-welding shift of TO-can pigtail package
2003 · Y.M. Cheung, C.H. Yiu · International Conference on Electronic Packaging Technology (ICEPT) · 3
Fabrication of 0.9PMN-0.1PT multilayer actuator
2001 · Kwan-Wai Tang, Helen Lai-Wa Chan, et al. · Ferroelectrics · 2
Measurement of post-welding shift for to-can pigtail package
2004 · C.H. Yiu, Y.M. Cheung · Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR) · 1
Fabrication of PZT multilayer actuator by a two-step sintering process
2001 · Yu Zhang, Kwan-Wai Tang, et al. · Ferroelectrics · 1
Assembly process automation and materials handling
2008 · Y.M. Cheung, D. Liu · Elsevier eBooks
Finite element analysis on transient post-welding shift of opto-electronic pigtail package
2005 · C.H. Yiu, Y.M. Cheung · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Integrated manufacturing cell analysis
1995 · Y. M Cheung
Works count: 21
Citation count: 383
H-index: 9
I10-index: 8
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