Author

C. Schaefer

Observed name: Christian Schaefer

Observed institutions: Aixtron (Germany), IBM Research - Thomas J. Watson Research Center, EV Group (Austria)

OpenAlex ID: A5110752008

3D interconnect through aligned wafer level bonding

2003 · P. Lindner, V. Dragoi, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 20

New challenges for 300mm Si technology: 3D interconnects at wafer scale by aligned wafer bonding

2002 · V. Dragoi, P. Lindner, et al. · Materials Science in Semiconductor Processing · 18

Progress in large-area glass coatings by high-rate sputtering

1995 · Günther Beister, Eckhard Dietrich, et al. · Surface and Coatings Technology · 13

Wafer level packaging and 3D interconnect for IC technology

2003 · R. Islam, C. Brubaker, et al. · ASMC proceedings · 10

Si/GaAs heterostructures fabricated by direct wafer bonding

2001 · Viorel Dragoi, Marin Alexe, et al. · MRS Proceedings · 5

One micron precision optically aligned method for hot-embossing and nanoimprinting

2003 · R. Islam, B. Wieder, et al. · Proceedings of IEEE Sensors/Proceedings of IEEE Sensors ... · 4

Investigation of GaN on Si(111) for optoelectronic applications

2003 · Y. Dikme, A. Szymakowski, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2

Reversible and Permanent Wafer Bonding for GaAs Processing

2001 · T. Glinsner, Thomas Luxbacher, et al. · 2

Advances in lithography technologies for wafer-level packaging

2003 · R. Pelzer, P. Kettner, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1

Vertical 3D interconnect through aligned wafer bonding

2003 · R. Peizer, T. Mafthias, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1

Surface grid technique for noncontact e-beam testing of very large scale integrated package substrate

1991 · K. L. Lee, C. Schaefer, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 1

3D Packaging Via Advanced-Chip-To-Wafer (AC2W) Bonding Enables Hybrid System-in-Package (SiP) Integration

2005 · Stefan Pargfrieder, Thorsten Matthias, et al. · Wafer-Level Packaging Symposium

Aligned Wafer Bonding for 3D Interconnect Technologies

2005 · Matthias Thorsten, Paul Lindner, et al. · Pan Pacific Symposium

Works count: 14

Citation count: 77

H-index: 5

I10-index: 4