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Xiaorui Lv

Human Neural Stem Cell Secretome Inhibits Lipopolysaccharide-Induced Neuroinflammation Through Modulating Microglia Polarization by Activating Peroxisome Proliferator-Activated Receptor Gamma
2022 · Jiqin Zhou, Wei Ni, et al. · Stem Cells and Development · 23
A ROS-responsive loaded desferoxamine (DFO) hydrogel system for traumatic brain injury therapy
2024 · Yun Qiu, Yu Zeng, et al. · Biomedical Materials · 20
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Recent advances in nanomedicine development for traumatic brain injury
2023 · Yating Ling, Murugan Ramalingam, et al. · Tissue and Cell · 10
Human Neural Stem Cell Secretome Inhibits Neuron Heme Uptake and Ferroptosis in Intracerebral Hemorrhage Through Nrf-2 Signaling Pathway
2023 · Xiaorui Lv, Yating Ling, et al. · Stem Cells and Development · 7
Submodelling method for modelling and simulation of high-density electronic assemblies
2020 · Lingsong Kong, Quanbin Yao, et al. · Journal of Physics Conference Series · 7
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Human neural stem cell secretome relieves endoplasmic reticulum stress-induced apoptosis and improves neuronal functions after traumatic brain injury in a rat model
2024 · Yating Ling, Murugan Ramalingam, et al. · Journal of Molecular Histology · 5
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Study on the solder joint reliability of plastic ball grid array package for high reliability application
2017 · Pengrong Lin, Xiaorui Lv, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
The influence of the solder joint void on the CCGA package reliability
2014 · Yingzhuo Huang, Binhao Lian, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
Reliability study of the solder joints in CCGA package during thermal test
2014 · Xiaorui Lv, Yingzhuo Huang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
Somatostatin receptor ligands suppressed proliferation and lipogenesis in 3T3‐L1 preadipocytes
2022 · Zhe Zhao, Fengying Gong, et al. · Basic & Clinical Pharmacology & Toxicology · 3
Preliminary exploration of endoplasmic reticulum stress transmission in astrocytes and neurons, and its mediators
2025 · yating ling, Muhammad Abid Hayat, et al. · Molecular Medicine Reports
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Experimental Investigations on Thermal Superposition Effect by Embedded Manifold Cooling
2023 · Yuxin Ye, Xiangbin Du, et al. · IEEE Electronics Packaging Technology Conference (EPTC)
The effects of Au film thickness on the reliability of Sn-Pb solder joints
2015 · Xiaorui Lv, Pengrong Lin, et al. · International Conference on Electronic Packaging Technology (ICEPT)
The influence of the solder joint void on the CCGA package reliability
2014 · Yingzhuo Huang, Binhao Lian, et al. · IEEE International Symposium on Applications of Ferroelectrics (ISAF)
Reliability study of the solder joints in CCGA package during thermal test
2014 · Xiaorui Lv, Yingzhuo Huang, et al. · IEEE International Symposium on Applications of Ferroelectrics (ISAF)
Works count: 15
Citation count: 87
H-index: 5
I10-index: 3
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