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Author

Hongtao Han

Observed names: H Han, H. Han
Observed institutions: Digital Optics Technologies (United States), Xperi (United States), American Metal Processing (United States), Shenzhen Technology University, Ocean University of China, Carnegie Mellon University
ORCID: 0009-0000-2868-2179
Observed ORCID: 0009-0000-2868-2179
OpenAlex ID: A5111375621
Recent Advances of Photocatalytic Application in Water Treatment: A Review
2021 · Guangmin Ren, Hongtao Han, et al. · Nanomaterials · 590
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Enhanced photocatalytic splitting of photothermally induced water vapor to evolve hydrogen
2022 · Hongtao Han, Kelei Huang, et al. · Chemical Engineering Journal · 63
Hydrothermal preparation of C3N4 on carbonized wood for photothermal-photocatalytic water splitting to efficiently evolve hydrogen
2023 · Hongtao Han, Xiangchao Meng · Journal of Colloid and Interface Science · 48
Review on solar-driven evaporator: Development and applications
2022 · Hongtao Han, Kelei Huang, et al. · Journal of Industrial and Engineering Chemistry · 46
Mechanisms of etch hillock formation
1996 · Song-Sheng Tan, M.L. Reed, et al. · Journal of Microelectromechanical Systems · 42
Morphology of etch hillock defects created during anisotropic etching of silicon
1994 · Song-Sheng Tan, M Reed, et al. · Journal of Micromechanics and Microengineering · 42
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Micromechanical Velcro
1992 · H. Han, L.E. Weiss, et al. · Journal of Microelectromechanical Systems · 41
An ion milling pattern transfer technique for fabrication of three-dimensional micromechanical structures
1993 · R. Dizon, Hongtao Han, et al. · Journal of Microelectromechanical Systems · 37
Silicon micro‐velcro
1992 · Michael L. Reed, Hongtao Han, et al. · Advanced Materials · 20
Mating and piercing micromechanical structures for surface bonding applications
2002 · H. Han, L.E. Weiss, et al. · IEEE International Conference on Micro Electro Mechanical Systems (MEMS) · 16
Wafer Level Camera technology - from wafer level packaging to wafer level integration
2010 · Hongtao Han, Moshe Kriman, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 14
High aspect ratio microstructures on porous anodic aluminum oxide
2005 · Songsheng Tan, M. Reed, et al. · IEEE International Conference on Micro Electro Mechanical Systems (MEMS) · 14
Nitrogen deficient porous C3N4 on carbon cloth as photoanode with enhanced photoelectrocatalytic activity in hydrogen production
2023 · Yixuan Wang, Jianpeng Sun, et al. · International Journal of Hydrogen Energy · 9
Process induced hillock defects on anisotropically etched silicon
2002 · Song-Sheng Tan, Hongtao Han, et al. · IEEE International Conference on Micro Electro Mechanical Systems (MEMS) · 9
Micromachined silicon structures for single-mode passive alignment
1996 · Hongtao Han, J. E. Schramm, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 7
Low cost camera modules using integration of wafer-scale optics and wafer-level packaging of image sensors
2009 · Hongtao Han, Keith Main · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6
A mechanical surface adhesive using micromachined silicon structures
1991 · H Han, M L Reed, et al. · Journal of Micromechanics and Microengineering · 6
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Development of internal wavelength lockers for tunable laser applications
2004 · Hongtao Han, B. Hammond, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
Design and modeling of a micromechanical surface bonding system
2002 · H. Han, L.E. Weiss, et al. · International Conference on Solid-State Sensors, Actuators and Microsystems · 5
Integration of silicon bench micro-optics
1999 · Hongtao Han, Jared D. Stack, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 5
Self-Assembly 4-Butylresorcinol Deep Eutectic Solvent Nanoparticles for Efficient Transdermal Delivery and Whitening
2025 · Hongtao Han, Dan Hu, et al. · Pharmaceuticals · 4
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Etching defects on KOH etched silicon-implementation of silicon bench technology for low cost packaging
2002 · H. Han, R. Boudreau, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3
Micro integration of VCSELs, detectors, and optics
1999 · John B. Hammond, Eric G. Johnson, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3
Low Cost Camera Modules Using Integration of Wafer-Scale Optics and Wafer-Level Packaging of Image Sensors
2009 · Hongtao Han, Keith Main · Asia Communications and Photonics Conference · 2
Integration of micro-optics with a fiber array connector using passive alignment technique for parallel optics applications
2004 · H. Han, J. Morris, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Works count: 42
Citation count: 1,046
H-index: 12
I10-index: 12
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