Author

K.-J. Wolter

Observed names: K-J Wolter, K-J. Wolter, K. - J. Wolter, K. -J. Wolter, K. J. Wolter, K. Wolter, K.-J Wolter, K.J. Wolter, Klaus J. Wolter, Klaus Jurgen Wolter, Klaus Jürgen Wolter, Klaus Wolter, Klaus-Jugen Wolter, Wolter, K., Wolter, K.-J., Wolter, K.J., Wolter, K.J. (eds.)

Observed institutions: Lomonosov Moscow State University, Fraunhofer Institute for Manufacturing Technology and Advanced Materials, Fraunhofer Institute for Ceramic Technologies and Systems, Technische Universität Dresden

OpenAlex ID: A5111889042

Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders

2004 · S. Wiese, K.-J. Wolter · Microelectronics Reliability · 105

Creep of thermally aged SnAgCu-solder joints

2006 · S. Wiese, K.-J. Wolter · Microelectronics Reliability · 80

Reliability of copper-ribbons in photovoltaic modules under thermo-mechanical loading

2010 · R. Meier, F. Kraemer, et al. · Conference record of the IEEE Photovoltaic Specialists Conference · 26

Characterization of the annealing behavior for copper-filled TSVs

2012 · P. Saettler, M. Boettcher, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 22

Embedded passive components for MCM

2002 · L.J. Golonka, K.-J. Wolter, et al. · International Spring Seminar on Electronics Technology · 20

Influence of artificial body fluids and medical sterilization procedures on chemical stability of Parylene C

2010 · N. Beshchasna, B. Adolphi, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 18

Creep of thermally aged SnAgCu-solder joints

2005 · S. Wiese, M. Roellig, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 18

Fodel microresistors––processing and basic electrical properties

2003 · A Dziedzic, L Rebenklau, et al. · Microelectronics Reliability · 17

Plasma treatment for fluxless soldering

2001 · R. Deltschew, D. Hirsch, et al. · Surface and Coatings Technology · 16

Mechanical characterization of porous nano-thin films by use of atomic force acoustic microscopy

2015 · M. Kopycinska-Müller, A. Clausner, et al. · Ultramicroscopy · 15

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Dual resonance excitation system for the contact mode of atomic force microscopy

2012 · M. Kopycinska-Müller, A. Striegler, et al. · Review of Scientific Instruments · 15

Experimental investigation of the visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations of automotive electronics

2014 · R. Metasch, M. Roellig, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 14

Reliability analysis of encapsulated components in 3D-circuit board integration

2018 · R. Schwerz, M. Roellig, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 13

Multi-scale radiographic applications in microelectronic industry

2016 · J. Gluch, M. Löffler, et al. · AIP conference proceedings · 12

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Mechanical characterization of nanoporous materials by use of atomic force acoustic microscopy methods

2013 · M Kopycinska-Müller, K-B Yeap, et al. · Nanotechnology · 12

Wettability effects of immersion tin final finishes with lead free solder

2008 · T. Hetschel, K.-J. Wolter, et al. · Electronic System-Integration Technology Conference (ESTC) · 12

Carbon nanotube (CNT) filled adhesives for microelectronic packaging

2008 · M. Wirts-Rutters, M. Heimann, et al. · Electronic System-Integration Technology Conference (ESTC) · 12

Extraction of material parameters for creep experiments on real solder-joints by FE analysis

2006 · M. Rollig, S. Wiese, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 12

Thermo-mechanical characterization and modeling of TSV annealing behavior

2012 · P. Saettler, D. Kovalenko, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 10

Innovative and Gentle Interconnection Technique for High Efficiency c-Si Solar Cells and Cost-of-Ownership-Analysis (COO)

2011 · Zemen, Y., Trommler, H., et al. · EU PVSEC · 9

Compositional Effects on the Creep Properties of SnAgCu Solder

2006 · S. Wiese, F. Kramer, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 9

Packaging of electronic devices for long-term implantation

2012 · Sabine Kirsten, Jurgen Uhlemann, et al. · International Spring Seminar on Electronics Technology · 8

Material characterization of organic packaging materials to increase the accuracy of FEM based stress analysis

2008 · B. Boehme, M. Roellig, et al. · Electronic System-Integration Technology Conference (ESTC) · 8

Reliability of embedding concepts for discrete passive components in organic circuit boards

2013 · R. Schwerz, B. Boehme, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7

Lifetime assessment for bipolar components under vibration and temperature loading

2013 · K. Meier, M. Roellig, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 7

Works count: 95

Citation count: 688

H-index: 13

I10-index: 19