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Shu-Chun Yang
Observed names:
S. J. Yang,
S.J. Yang
Institutions:
Taiwan Semiconductor Manufacturing Company (China),
Taiwan Semiconductor Manufacturing Company (Taiwan)
Observed institutions:
Taiwan Semiconductor Manufacturing Company (China),
Taiwan Semiconductor Manufacturing Company (Taiwan)
ORCID:
0009-0004-6496-7795
Observed ORCID:
0009-0004-6496-7795
OpenAlex ID:
A5111904560
A 7-nm 4-GHz Arm¹-Core-Based CoWoS¹ Chiplet Design for High-Performance Computing
2020
·
Mu-Shan Lin
, Tze-Chiang Huang
, et al.
·
IEEE Journal of Solid-State Circuits
·
98
65nm CMOS high speed, general purpose and low power transistor technology for high volume foundry application
2004
·
S.K.H. Fung
, H.T. Huang
, et al.
·
Symposium on VLSI Technology
·
47
A 7nm 4GHz Arm®-core-based CoWoS® Chiplet Design for High Performance Computing
2019
·
Mu-Shan Lin
, Tze-Chiang Huang
, et al.
·
Symposium on VLSI Circuits
·
43
A highly scaled, high performance 45 nm bulk logic CMOS technology with 0.242 μm2 SRAM cell
2007
·
Kuan-Lun Cheng
, C. C. Wu
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
37
A 5Gb/s low-power PCI express/USB3.0 ready PHY in 40nm CMOS technology with high-jitter immunity
2009
·
Mu-Shan Lin
, Chien-Chun Tsai
, et al.
·
IEEE Asian Solid-State Circuits Conference (A-SSCC)
·
22
36.1 A 32Gb/s 10.5Tb/s/mm 0.6pJ/b UCIe-Compliant Low-Latency Interface in 3nm Featuring Matched-Delay for Dynamic Clock Gating
2025
·
Mu-Shan Lin
, Chien-Chun Tsai
, et al.
·
Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference
·
15
A 16nm 256-bit wide 89.6GByte/s total bandwidth in-package interconnect with 0.3V swing and 0.062pJ/bit power in InFO package
2016
·
Mu-Shan Lin
, Chien-Chun Tsai
, et al.
·
IEEE Hot Chips Symposium
·
12
A 56Gb/s PAM-4 Receiver with Voltage Pre-Shift CTLE and 10-Tap DFE of Tap-1 Speculation in 7nm FinFET
2019
·
Wei-Chih Chen
, Shu-Chun Yang
, et al.
·
Symposium on VLSI Circuits
·
10
A 1 Tbit/s Bandwidth 1024 b PLL/DLL-Less eDRAM PHY Using 0.3 V 0.105 mW/Gbps Low-Swing IO for CoWoS Application
2014
·
Mu-Shan Lin
, Chien-Chun Tsai
, et al.
·
IEEE Journal of Solid-State Circuits
·
10
A 2.5-8Gb/s transceiver with 5-tap DFE and Second order CDR against 28-inch channel and 5000ppm SSC in 40nm CMOS technology
2010
·
Wei-Chih Chen
, Chien-Chun Tsai
, et al.
·
Custom Integrated Circuits Conference
·
8
UCle-Compliant Chiplet Interconnect Design Leveraging Cutting-Edge Packaging Technologies
2025
·
Yu-Jie Huang
, Mu-Shan Lin
, et al.
·
Custom Integrated Circuits Conference
·
3
A 0.296pJ/bit 17.9Tb/s/mm2 Die-to-Die Link in 5nm/6nm FinFET on a 9μm-Pitch 3D Package Achieving 10.24Tb/s Bandwidth at 16Gb/s PAM-4
2024
·
Mu-Shan Lin
, Chien-Chun Tsai
, et al.
·
IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
·
2
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Works count:
12
Citation count:
307
H-index:
9
I10-index:
9
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