Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Hsin-Ying Peng
Observed name:
H. Y. Peng
Observed institution:
National Yang Ming Chiao Tung University
OpenAlex ID:
A5112216699
Analysis of bump resistance and electrical distribution of ultra-fine-pitch microbumps
2010
·
Y. W. Chang
, H. Y. Peng
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
2
The temperature distribution and the thermal behavior in ultra fine pitch micro SnAg solder bump under current stressing
2010
·
Hsin-Ying Peng
, Y. W. Chang
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
1
Plasma damage and restoration of a spin-on organic ultra low-k material (k=2.3)
2012
·
Mikołaj Łukaszewicz
, Jean‐François de Marneffe
, et al.
·
Bulletin of the American Physical Society
Influence of trace geometry on the current crowding effect in ultra-fine pitch MicroBump
2010
·
Y. W. Chang
, H. Y. Peng
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
Shape effect of passivation opening on the electric behavior in flip-chip SnAg solder joints under electromigration
2009
·
Hsin-Ying Peng
, Chih Chen
·
IEEE Electronics Packaging Technology Conference (EPTC)
Show more works
View as search
Works count:
6
Citation count:
3
H-index:
1
I10-index:
Year
Topic
Type
