Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Poh Leng Eu
Observed names:
P. L. Eu,
P.L. Eu
Observed institution:
NXP (Germany)
OpenAlex ID:
A5112227754
Correlation studies for component level ball impact shear test and board level drop test
2008
·
E.H. Wong
, R. Rajoo
, et al.
·
Microelectronics Reliability
·
40
A study of crack propagation in Pb-free solder joints under drop impact
2008
·
J.F.J. Caers
, E.H. Wong
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
26
A Study of Crack Propagation in Pb-Free Solder Joints
2010
·
J. F. J. M. Caers
, X. J. Zhao
, et al.
·
IEEE Transactions on Electronics Packaging Manufacturing
·
18
Development and qualification of copper wire bond process for automotive applications
2012
·
Pey Fang Hiew
, Yin Kheng Au
, et al.
·
International Conference on Electronic Materials and Packaging
·
12
Process optimization approach in fine pitch Cu wire bonding
2011
·
B. K. Wong
, C.C. Yong
, et al.
·
International Conference on Electronic Devices, Systems and Applications
·
9
Effect of Ni Layer Thickness on Intermetallic Formation and Mechanical Strength of Sn-Ag-Cu Solder Joint
2008
·
Kelvin Pun
, Poh Leng Eu
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
9
A Parametric Study of Thermal Stress and Analysis of Creep Strain Under Thermal Cyclic Loading in a Hybrid Quad Flat Package
2020
·
D. Zhou
, A. S. M. A. Haseeb
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
8
Importance of Cu/Al Intermetallic coverage in copper wire bonding with sensitive pad structure
2012
·
Tracy Jia Lin Yap
, Yin Kheng Au
, et al.
·
International Conference on Electronic Materials and Packaging
·
8
Mold Compound and Copper Wire Selection for Quad-Flat Packages with High Density Leadframe in Automotive Applications
2018
·
Vanessa Wyn Jean Tan
, Yin Kheng Au
, et al.
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
·
5
A Study of Component-Level Measure of Board-Level Drop Impact Reliability by Ball Impact Test
2008
·
Yi-Shao Lai
, E. H. Wong
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
5
Dual Row QFN Roughen Lead Frame Mold Flash Challenges & Resolution
2022
·
Pey Fang Hiew
, Poh Leng Eu
, et al.
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
·
3
Challenges and Resolutions of 28nm Copper Wire Bond Process for Automotive Application
2024
·
Pey Fang Hiew
, Tsung-Nan Lo
, et al.
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
·
2
Investigation of bond pad etching chemistries for passivation crack
2010
·
Rusli Ibrahim
, Michael Leoni
, et al.
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
·
2
Solder Extrusion Characterization Study on SiP Modules Inductors
2022
·
Antonio A. M. Macatangay
, Jae Yun Kim
, et al.
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
·
1
Performance of a hybrid fine pitch quad flat package mounted with a new flux on printed circuit board in surface insulation resistance test
2020
·
D. Zhou
, A.S.M.A. Haseeb
, et al.
·
Materialwissenschaft und Werkstofftechnik
·
1
Investigation of Package Delamination Behavior in Large Quad Flat No-Lead Package
2024
·
Tsung Nan Lo
, Chang Hao Liu
, et al.
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
Impacts of Saw Blade Selection, Dressing and Dicing Parameters on Die Sidewall Quality
2024
·
Teck Beng Lau
, Andersen Yu-Jen Tien
, et al.
·
IEEE/CPMT International Electronics Manufacturing Technology Symposium
Show more works
View as search
Works count:
17
Citation count:
149
H-index:
8
I10-index:
4
Year
Topic
Type
