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Author

Gokul Kumar

Observed name: Gokul Kumar K
ORCID: 0000-0001-7667-9599
Observed ORCID: 0000-0001-7667-9599
OpenAlex ID: A5112460770
An Overview of Substrate Copper Trace Crack Through Experiments, Characterization, and Numerical Simulations
2025 · Wei Yu, Faxing Che, et al. · Micromachines · 2
Development of Data Acquisition and Analysis System: Telemetry in Automotive
2019 · Divyansh Rastogi, Gokul Kumar, et al. · SAE technical papers on CD-ROM/SAE technical paper series · 2
Using a Novel Co-Design Prototyping Approach for System-in-Package Devices
2025 · Matthew Monroe, Gokul Kumar, et al. · IMAPSource Proceedings · 1
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Analysis of Substrate Trace Cracking in Combined Power and Thermal Cycling Reliability Test
2024 · Manish Nayini, Ramesh Nallavelli, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1
Failure evaluation on tailor made aerospace aluminum alloys via underwater friction stir welding employing predictive machine learning technologies
2024 · Arun Prakash S, Gokul Kumar K · Engineering Research Express · 1
Parametric study of factors effecting PMIC-QFN reliability under temperature cycling in DIMM systems
2024 · Nagavenkata Varaprasad Nune, Christopher Glancey, et al. · IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
Leakage current based Thermal Design Approach for SSD Reliability
2024 · Ramesh Nallavelli, Prasad N V Nune, et al. · IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
Investigations on the Tensile Properties of Ultrasonic Plastic Welded Components for Automotive Application
2018 · Kumar Raja, C D Naiju, et al. · SAE technical papers on CD-ROM/SAE technical paper series
Works count: 8
Citation count: 7
H-index: 2
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