Get started
Author

Ikuo Shohji

Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity
2003 · Ikuo Shohji, Tomohiro Yoshida, et al. · Materials Science and Engineering A · 200
Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints
2002 · Ikuo Shohji, Takao Nakamura, et al. · MATERIALS TRANSACTIONS · 84
PDF
Solder joint reliability evaluation of chip scale package using a modified Coffin–Manson equation
2003 · Ikuo Shohji, Hideo Mori, et al. · Microelectronics Reliability · 60
Creep properties of Sn-8Mass%Zn-3Mass%Bi lead-free alloy
2004 · Ikuo Shohji, Colin Gagg, et al. · Journal of Electronic Materials · 40
Comparison of low-melting lead-free solders in tensile properties with Sn–Pb eutectic solder
2004 · Ikuo Shohji, Tomohiro Yoshida, et al. · Journal of Materials Science Materials in Electronics · 38
Intermetallic compound layer formation between Au and In-48Sn solder
1999 · I Shohji, S Fujiwara, et al. · Scripta Materialia · 30
Mechanistic study of Ni–Cr–P alloy electrodeposition and characterization of deposits
2021 · Shubin Liu, Ikuo Shohji, et al. · Journal of Electroanalytical Chemistry · 29
Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders
2008 · Ikuo Shohji, Tsutomu Osawa, et al. · MATERIALS TRANSACTIONS · 29
PDF
Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions
2005 · Ikuo Shohji, Satoshi Tsunoda, et al. · MATERIALS TRANSACTIONS · 29
PDF
Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders
2002 · Ikuo Shohji, Tomohiro Yoshida, et al. · MATERIALS TRANSACTIONS · 29
PDF
Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper
2010 · Shinji Koyama, Yukinari Aoki, et al. · MATERIALS TRANSACTIONS · 26
PDF
Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder
2021 · Mizuki Yamamoto, Ikuo Shohji, et al. · Materials · 23
PDF
Comparison of Sn‐5Sb and Sn‐10Sb Alloys in Tensile and Fatigue Properties Using Miniature Size Specimens
2018 · Tatsuya Kobayashi, Kyosuke Kobayashi, et al. · Advances in Materials Science and Engineering · 22
PDF
Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode
2008 · Ikuo Shohji, Hirohiko Watanabe, et al. · MATERIALS TRANSACTIONS · 21
PDF
Degradation Behaviors of Adhesion Strength of Structural Adhesive for Weld-Bonding under High Temperature and Humidity Conditions
2017 · Yugo Tomita, Ikuo Shohji, et al. · Procedia Engineering · 17
PDF
Microstructure and Fatigue Behaviors of Dissimilar A6061/Galvannealed Steel Joints Fabricated by Friction Stir Spot Welding
2021 · Koki Kumamoto, Tsuyoshi Kosaka, et al. · Materials · 16
Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder
2016 · Zhang Haidong, Ikuo Shohji, et al. · MATERIALS TRANSACTIONS · 16
PDF
Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders
2001 · Ikuo Shohji, Fuminari Mori, et al. · MATERIALS TRANSACTIONS · 15
PDF
Effects of Ni Addition to Sn–5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties
2019 · Tatsuya Kobayashi, Kohei Mitsui, et al. · MATERIALS TRANSACTIONS · 14
PDF
Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls
2004 · Ikuo Shohji, Yuji Shiratori, et al. · MATERIALS TRANSACTIONS · 14
PDF
Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn‐5Sb and Sn‐10Sb Solder Joints
2018 · Tatsuya Kobayashi, Ikuo Shohji, et al. · Advances in Materials Science and Engineering · 13
PDF
Tensile and Fatigue Properties of Miniature Size Specimens of Sn-5Sb Lead-Free Solder
2016 · Kyosuke Kobayashi, Ikuo Shohji, et al. · Materials science forum · 13
Effect of Cu Cored Ball in Solder Ball on Microstructure and Strength of BGA Joint.
1999 · Shinya KIYONO, Keisuke UENISHI, et al. · Journal of The Japan Institute of Electronics Packaging · 13
PDF
Joining process of dissimilar materials using three-dimensional electrodeposited Ni-Cu film
2021 · T. Kobayashi, I. Shohji · Materials and Manufacturing Processes · 12
Degradation Behaviors of Adhesion Strength between Epoxy Resin and Copper Under Aging at High Temperature
2017 · Yu Tonozuka, Ikuo Shohji, et al. · Procedia Engineering · 12
PDF
Works count: 250
Citation count: 1,327
H-index: 16
I10-index: 31
Year
Topic
Type