Author

Yong Suk Oh

Observed name: Yong suk Oh

Institutions: Chosun University, Changwon National University

Observed institutions: Chosun University, Changwon National University, Catholic University of Korea

ORCID: 0000-0002-5370-2781

Observed ORCID: 0000-0002-5370-2781

OpenAlex ID: A5112981173

Acute Changes in Cardiac Synchrony and Output According to RV Pacing Sites in Koreans with Normal Cardiac Function

2009 · Hee Jeoung Yoon, Seung Won Jin, et al. · Echocardiography · 11

Wireless, Battery‐Free, Optoelectronic, Multi‐Modal Sensor Integrated With Colorimetric Dressing for Diabetic Ulcer Management

2026 · Seokjoo Cho, Ji‐Hwan Ha, et al. · Advanced Functional Materials · 8

A battery-free, wireless graphene pressure sensor for machine learning-assisted posture classification and VR/AR visualization in smart healthcare environments

2026 · Myungwoo Choi, Younghan Kim, et al. · Materials Horizons · 4

Effect of graphite nanoplatelet content on the friction and wear properties of basalt fiber-reinforced polymer composites

2026 · Tae Hwan Jang, Johan Jo, et al. · Results in Engineering · 2

Twisting mechanical metamaterials: a review of architecture-dependent compression-twist coupling

2026 · Jaehun Yang, Seongcheol Lee, et al. · Materials & Design

Development of Lamb Wave and CNN–Integrated Damage Identifier for GFRP Composites

2026 · Yonghee Lee, Yong suk Oh, et al. · e-Journal of Nondestructive Testing

Advancement of damage reconstruction techniques for corrosion damage detection based on higher-order Lamb wave inspection via NHST approach

2026 · Yonghee Lee, Yong Suk Oh, et al. · Measurement

Wireless, Battery‐Free, Optoelectronic, Multi‐Modal Sensor Integrated With Colorimetric Dressing for Diabetic Ulcer Management (Adv. Funct. Mater. 25/2026)

2026 · Seokjoo Cho, Ji‐Hwan Ha, et al. · Advanced Functional Materials

Thermo-mechanical reliability and scalability of copper-pillar solder-cap interconnects for micro-LEDs

2026 · Junhyeock Kim, Ho-Jung Jeong, et al. · Microelectronics Reliability

Friction and Wear Behavior of MoS2 Reinforced AlCoCrFeNi High–Entropy Alloy Composite

2026 · Dogyun Byeon, TaeHwan Jang, et al. · SSRN Electronic Journal

Numerical analysis for deriving precision thermoforming mechanism of aspherical lens

2025 · Jaehun Choi, Geonho Kim, et al. · Case Studies in Thermal Engineering

One-Step Nanoscale Patterning of Silver Ionic Ink via Elastic Mold Deformation

2023 · Yong Suk Oh · Journal of Sensor Science and Technology

Works count: 14

Citation count: 26

H-index: 3

I10-index: 1