Author

Jiawang Wen

Institutions: Minjiang University, Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China

Observed institutions: Minjiang University, Fujian Science and Technology Innovation Laboratory for Optoelectronic Information of China

ORCID: 0009-0001-9409-0910

Observed ORCID: 0009-0001-9409-0910

OpenAlex ID: A5113159015

Simultaneous Reduction of Bulk and Contact Thermal Resistance in High‐Loading Thermal Interface Materials Using Self‐Assembled Monolayers

2024 · Xiu He, Xirui Liu, et al. · Advanced Functional Materials · 41

Flexible rubber with metal-like thermal conductivity achieved via hydrogen bonding engineering

2026 · Xirui Liu, Jiawang Wen, et al. · Nature Communications · 11

A steady-state method apparatus for measuring the thermal conductivity of flexible electronic materials under stretching

2025 · Xirui Liu, Jiawang Wen, et al. · Measurement · 5

Structure-thermal transport relationships in polymers-based composites: Models, metrology, and microstructure control

2026 · Munshi Jasimuddin, Zhijie Wang, et al. · Chinese Journal of Structural Chemistry · 1

Works count: 4

Citation count: 58

H-index: 3

I10-index: 2