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Jen-Chun Chen
Observed name:
J J Chen
Institution:
Advanced Semiconductor Engineering (Taiwan)
Observed institution:
Advanced Semiconductor Engineering (Taiwan)
ORCID:
0009-0007-8287-624X
Observed ORCID:
0009-0007-8287-624X
OpenAlex ID:
A5113265291
Novel multiple compartments shielding for high performance RF design — LTE modem SiP
2014
·
Harrison Chang
, J J Chen
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
13
Electrical performance characterization for novel multiple compartments shielding and verification on LTE modem SiP
2014
·
Albert Lin
, Vincent Chen
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
5
Correlation of synergistic effect and intertube transfer barrier in conductive composites made from carbon nanotubes, graphene nanoplatelets and liquid silicone rubber
2025
·
Ping-Chun Chen
, Ching-Hao Liu
, et al.
·
Polymer Testing
·
2
In Situ Electrical Characterization of Carbon Nanotubes in O2 and N2 Plasma to Explain their Field Emission Instability
2024
·
Yen-Hung Kuo
, Jen-Kuang Fang
, et al.
·
ACS Applied Nano Materials
·
2
A Novel Mitigate Solder Bridging in Double-Sided Copper-Exposed Power Modules
2025
·
Yu-Hsien Chien
, Ching-Yao Hsu
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
Investigation on in-Process Crack Propagation Behavior of Al 2 O 3 Direct Bond Copper Substrate
2025
·
Yu-Shan Huang
, Jen-Chun Chen
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
Thermal and Reliability-Oriented Structural Optimization of IMS Substrates for Power Module Applications
2025
·
Tsung-Han Li
, Pouria Zaghari
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
Design on Trapezoidal and Pyramidal Shaped Dielectric Resonator Antennas for Millimeter Wave Applications (IMPACT 2025)
2025
·
Yu-Hur Shih
, Jen-Chun Chen
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
Optimize Power Module Sintering Methodology for High Thermal Conductivity and Reliability
2025
·
Jen-Kuang Fang
, Jen-Chun Chen
, et al.
·
International Conference on Electrical, Computer and Energy Technologies (ICECET)
Buildup of Conductive Networks in Liquid Silicone Rubber Bioelectrode by Heat Treatment for Microelectronic Devices
2025
·
Jen-Kuang Fang
, Jen-Chun Chen
, et al.
·
International Conference on Electrical, Computer and Energy Technologies (ICECET)
Using Flexible Hybrid Electronics on a Miniaturized Non-invasive Bio-optical Sensor For Hemoglobin Detection
2024
·
Yu-Chil Lee
, Kai-Lun Yu
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
Rescaffolding Carbon Nanotubes in Thermoset Polymers by Heat Treatments
2024
·
Jen-Kuang Fang
, Jen-Chun Chen
, et al.
·
Advances in Polymer Technology
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Works count:
12
Citation count:
22
H-index:
2
I10-index:
1
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