Author

Tengying Guo

Observed names: T. M. Guo, T.M. Guo, Tianhui Guo

Institution: Beihang University

Observed institutions: University of Akron, Beihang University

ORCID: 0009-0003-7603-5744

Observed ORCID: 0009-0003-7603-5744

OpenAlex ID: A5113331757

An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin–lead solder

2003 · D.C. Lin, S. Liu, et al. · Materials Science and Engineering A · 89

Increasing joint strength by achieving carbon fibers’ continuity with ultrasonic assistance during soldering Cf/Al using ZnAl

2024 · Zhengwei Li, Zhiwu Xu, et al. · Materials Letters · 4

Ultrarapid soldering Cf/Al by inactive solder by ultrasonic assistance

2024 · Zhengwei Li, Zhiwu Xu, et al. · Journal of Materials Processing Technology · 3

Dynamic Estimation of Formation Wake Flow Fields Based on On-Board Sensing

2025 · Tianhui Guo, Tielin Ma, et al. · Drones · 2

Interface Shape and Melt Flow Near the Solid-Liquid Interface During Horizontal Unidirectional Solidification

2003 · T. M. Guo, H. Li, et al.

A Study of the Transport of Nanopowders in a Solidifying Solder Melt and its Influence on Microstructural Development

2001 · D. C. Lin, S. Liu, et al.

Works count: 6

Citation count: 98

H-index: 3

I10-index: 1