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H.Y. Li

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
2009 · Xiaowu Zhang, T.C. Chai, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 112
Development of Wafer-Level Warpage and Stress Modeling Methodology and Its Application in Process Optimization for TSV Wafers
2012 · Faxing Che, Hongyu Y. Li, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 79
Modelling and characterization on wafer to wafer hybrid bonding technology for 3D IC packaging
2019 · L. Ji, F.X. Che, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 44
A small OCA on a 1/spl times/0.5-mm/sup 2/ 2.45-GHz RFID Tag-design and integration based on a CMOS-compatible manufacturing technology
2006 · L.H. Guo, A.P. Popov, et al. · IEEE Electron Device Letters · 24
Bendability of single-crystal Si MOSFETs investigated on flexible substrate
2006 · H.Y. Li, L.H. Guo, et al. · IEEE Electron Device Letters · 23
Novel Monolithic Integration of RF-MEMS Switch with CMOS-IC on Organic Substrate for Compact RF System
2006 · Q. X. Zhang, A.B. Yu, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 17
A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections
2004 · C.F. Tsang, C.K. Chang, et al. · Microelectronics Reliability · 14
Impact of packaging design on reliability of large die Cu/low-κ (BD) interconnect
2008 · T.C. Chai, Xiaowu Zhang, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 13
Successful transferring of active transistors, rf-passive components and high density interconnect from bulk si to organic substrates
2006 · L.H. Guo, Q.X. Zhang, et al. · 13
Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay
2012 · K. Ghosh, J. Zhang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 12
High-Q on-chip inductors using extremely thick silicon dioxide and copper-damascene technology
2008 · M. Tang, H.Y. Li, et al. · Electronics Letters · 10
Effect of Prebonding Anneal on the Microstructure Evolution and Cu–Cu Diffusion Bonding Quality for Three-Dimensional Integration
2012 · L. Peng, D.F. Lim, et al. · Journal of Electronic Materials · 9
Integration of RF MEMS and CMOS IC on a Printed Circuit Board for a Compact RF System Application Based on Wafer Transfer
2008 · Q.X. Zhang, A.B. Yu, et al. · IEEE Transactions on Electron Devices · 8
High performance embedded RF passive device process integration
2008 · H. Y. Li, Y. M. Khoo, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 6
Effects of plasma treatments on structural and electrical properties of methyl-doped silicon oxide low dielectric constant film
2005 · W.Y. Leong, C.F. Tsang, et al. · Thin Solid Films · 6
Enhancing the efficiency of postetch polymer removal using megasonic wet clean for 0.13-μm dual damascene interconnect process
2004 · C.K. Chang, T.H. Foo, et al. · Thin Solid Films · 6
Design, fabrication and electrical characterization of TSV
2010 · L. Zhang, H.Y. Li, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 5
Defect study on Nanoglass® E porous ultra-low k material (k∼2.2) for ultra-large-scale integration applications
2004 · L. Zhang, Y.W. Chen, et al. · Materials Science in Semiconductor Processing · 5
Spatial variation of TSV capacitance and method of stabilization with Al2O3-induced negative fixed charge at the silicon-liner interface
2011 · L. Zhang, R. I Made, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 4
Built-in via module test structure for backend interconnection in-line process monitor
2005 · H.Y. Li, W.H. Li, et al. · International Symposium on the Physical and Failure Analysis of Integrated Circuits · 4
Boosting polysulfides conversion with Fe3O4-loaded carbon derived from willow sawdust for high sulfur loading and lean electrolyte lithium-sulfur batteries
2025 · Yu Jiang, Yu Jiang, et al. · Journal of Power Sources · 3
Surface Electrode Ion Trap Developed and Improvement by Oxide- First- Metal-Last Approach for High Performance Quantum Computing
2020 · H.Y. Li, Wen Wei Seit, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 3
Simultaneous formation of electrical connection, mechanical support and hermetic seal with bump-less cu-cu bonding for 3D wafer stacking
2012 · L. Peng, J. Fan, et al. · 3
Functional Materials and Nanotechnology
2012 · B. Xu, H.Y. Li · Trans Tech Publications Ltd. eBooks · 3
Study of barrier layer thickness effect for the micro-bump
2015 · H.Y. Li, Norhanani Binte Jaafar, et al. · 2
Works count: 39
Citation count: 439
H-index: 10
I10-index: 11
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