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Brian Lien
Observed names:
B S Lien,
B. S. Lien,
B.-S. Lien
Institution:
Vanguard International Semiconductor (Taiwan)
Observed institutions:
Taiwan Semiconductor Manufacturing Company (Taiwan),
Vanguard International Semiconductor (Taiwan)
OpenAlex ID:
A5113412098
Self-Heating Temperature Behavior Analysis for DC - GHz Design Optimization in Advanced FinFETs
2019
·
S. L. Liu
, J. J. Horng
, et al.
·
Symposium on VLSI Technology
·
11
How Fault-Tolerant Quantum Computing Benefits from Cryo-CMOS Technology
2023
·
H.-L. Chiang
, R. A. Hadi
, et al.
·
IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
·
10
The Influence of Gate-Series-Resistor on the ESD Protection and Switching Speed for 650V GaNHEMT Circuit
2024
·
Jian-Hsing Lee
, Yeh-Jen Huang
, et al.
·
IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
·
6
An Area-Saving and Low-Leakage ESD Protection Circuit for 650V E-Mode GaN-HEMT
2025
·
Jian-Hsing Lee
, Yeh-Jen Huang
, et al.
·
IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
·
1
Hot-Spot Thermal Sensor Design in FinFETs
2019
·
S. L. Liu
, J. J. Horng
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
FinFETにおけるホットスポット熱センサ設計【JST・京大機械翻訳】
2019
·
S L Liu
, J J Horng
, et al.
·
IEEE Conference Proceedings
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Works count:
6
Citation count:
28
H-index:
3
I10-index:
2
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