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Author

H. Teng

Observed names: H. A. Teng, H.A. Teng
OpenAlex ID: A5113426446
High-aspect ratio through silicon via (TSV) technology
2012 · H.B. Chang, H.Y. Chen, et al. · Symposium on VLSI Technology · 18
An ultra-thin interposer utilizing 3D TSV technology
2012 · W.C. Chiou, K.F. Yang, et al. · Symposium on VLSI Technology · 16
Thinning, stacking, and TSV proximity effects for Poly and High-K/Metal Gate CMOS devices in an advanced 3D integration process
2012 · T. Lo, M. F. Chen, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 14
Orthotropic stress field induced by TSV and its impact on device performance
2011 · C. C. Hsieh, H. A. Teng, et al. · IEEE International Interconnect Technology Conference (IITC) · 11
Yield and reliability of 3DIC technology for advanced 28nm node and beyond
2011 · K.F. Yang, Ting Wu, et al. · Symposium on VLSI Technology · 9
An integrated air gap structure to achieve high-performance TSV interconnects for 28nm 3D-IC integration
2013 · E.B. Liao, Kai-Yu Cheng, et al. · Symposium on VLSI Technology · 3
Statistical Analysis of Residual Stress Profiles Using a Heuristic Method
2008 · H. Teng, S. K. Bate, et al. · Volume 1: Codes and Standards · 3
Further Predictions of Fracture Experiments of a Pre-Cracked Pressurised Thermal Shock Disk (PTS-D) Specimen Under Warm Prestressing Loading Cycles
2012 · H. Teng, J. K. Sharples, et al.
The Effects of Warm Pre-Stressing of a Pre-Cracked Pressurised Thermal Shock Disk Specimen Under a LUCF Loading Cycle
2011 · H. Teng, D. W. Beardsmore, et al.
On the Expected Errors in Calibration of the Beremin Cleavage Model Parameters
2007 · D. W. Beardsmore, H. Teng, et al.
Load and Crack History Effects on Fracture
2007 · J. K. Sharples, P. M. James, et al.
Works count: 11
Citation count: 74
H-index: 5
I10-index: 4
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