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J.L. Yeh

An ultra-thin interposer utilizing 3D TSV technology
2012 · W.C. Chiou, K.F. Yang, et al. · Symposium on VLSI Technology · 16
Selective tungsten on aluminum for improved VLSI interconnects
1986 · H.P.W. Hey, A.K. Sinha, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 8
Works count: 2
Citation count: 24
H-index: 2
I10-index: 1
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