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Ker‐Chang Hsieh

Observed names: Hsieh Ker-Chang, K. -C. Hsieh, K. C. Hsieh, K.-C. Hsieh, K.C. Hsieh, Ker-Chang Hsieh, Ker-chang Hsieh
Observed institutions: University of Wisconsin System, University of Wisconsin–Madison, National Sun Yat-sen University, Sun Yat-sen University, Advanced Semiconductor Engineering (Taiwan), National Cheng Kung University
ORCID: 0000-0003-1043-9212
Observed ORCID: 0000-0003-1043-9212
OpenAlex ID: A5113985107
Two-glassy-phase bulk metallic glass with remarkable plasticity
2007 · X. H. Du, J. C. Huang, et al. · Applied Physics Letters · 129
Designing novel lightweight, high-strength and high-plasticity Ti (AlCrNb)100- medium-entropy alloys
2019 · Y.C. Liao, T.H. Li, et al. · Intermetallics · 81
The microstructure and phase equilibrium of new high performance high-entropy alloys
2008 · Ker-Chang Hsieh, Cheng-Fu Yu, et al. · Journal of Alloys and Compounds · 80
A thermodynamic analysis of the phase equilibria of the Fe-Ni system above 1200 K
1986 · Ying-Yu Chuang, Ker-Chang Hsieh, et al. · Metallurgical Transactions A · 72
Phase diagram of TiAlO at 1100°C
1992 · M.-X. Zhang, K.-C. Hsieh, et al. · Scripta Metallurgica et Materialia · 65
Cu wire bond microstructure analysis and failure mechanism
2010 · Cheng-Fu Yu, Chi-Ming Chan, et al. · Microelectronics Reliability · 63
Thermodynamics and phase relationships of transition metal-sulfur systems: Part V. A reevaluation of the Fe-S system using an associated solution model for the liquid phase
1985 · Y. Y. Chuang, K. C. Hsieh, et al. · Metallurgical Transactions B · 62
Phase-separated microstructures and shear-banding behavior in a designed Zr-based glass-forming alloy
2009 · X.H. Du, J.C. Huang, et al. · Intermetallics · 50
Computational thermodynamics to identify Zr–Ti–Ni–Cu–Al alloys with high glass-forming ability
2006 · Hongbo Cao, Dong Ma, et al. · Acta Materialia · 47
Thermodynamic properties and phase equilibria of Sn–Bi–Zn ternary alloys
2008 · Ching-feng Yang, Feng-ling Chen, et al. · Materials Chemistry and Physics · 42
Effect of Al concentration on the microstructural and mechanical properties of lightweight Ti60Alx(VCrNb)40-x medium-entropy alloys
2021 · Y.C. Liao, W.T. Ye, et al. · Intermetallics · 38
Phase Diagrams of Ternary Copper-Oxygen-Metal Systems
1989 · Y. A. Chang, Ker‐Chang Hsieh · Medical Entomology and Zoology · 38
Thermochemical Description of the Ternary Iron-Nickel-Sulfur System
1987 · Ker-Chang Hsieh, Y. Austin Chang · Canadian Metallurgical Quarterly · 38
The orientation relationships of the Cu3Sn/Cu interfaces and a discussion of the formation sequence of Cu3Sn and Cu6Sn5
2014 · Kuang-Kuo Wang, Dershin Gan, et al. · Thin Solid Films · 33
Phase equilibria of GaNiAs at 600°C and the structural relationship between γ-Ni3Ga2, γ′-Ni13Ga9 and TNi3GaAs
1989 · X.-Y. Zheng, J.-C. Lin, et al. · Materials Science and Engineering B · 33
Designing Ductile Zr‐Based Bulk Metallic Glasses with Phase Separated Microstructure
2009 · Xinghao Du, Jacob C. Huang, et al. · Advanced Engineering Materials · 32
Bulkier glass formability enhanced by minor alloying additions
2005 · D. Ma, H. Cao, et al. · Applied Physics Letters · 32
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Bromine- and chlorine-induced degradation of gold-aluminum bonds
2004 · Min-Hsien Lue, Chen-Town Huang, et al. · Journal of Electronic Materials · 30
The effect of Pd and Cu in the intermetallic growth of alloy Au wire
2003 · Hen-So Chang, Ker-Chang Hsieh, et al. · Journal of Electronic Materials · 29
A solid-state emf study of ternary Ni-S-O, Fe-S-O, and quaternary Fe-Ni-S-O
1986 · Ker-Chang Hsieh, Y. Austin Chang · Metallurgical Transactions B · 29
The Fe−Ni−S system above 700°C (Iron−Nickel−Sulfur)
1982 · Ker-Chang Hsieh, Y. Austin Chang, et al. · Bulletin of Alloy Phase Diagrams · 29
The effect of tin grain structure on whisker growth
2010 · Cheng-Fu Yu, Chi-Ming Chan, et al. · Microelectronics Reliability · 28
Sn-Cu Intermetallic Grain Morphology Related to Sn Layer Thickness
2007 · Min-Hsien Lu, Ker-Chang Hsieh · Journal of Electronic Materials · 27
The influence of thermal aging on joint strength and fracture surface of Pb/Sn and Au/Sn solders in laser diode packages
2002 · M. T. Sheen, C. M. Chang, et al. · Journal of Electronic Materials · 26
Development of Novel Lightweight Dual-Phase Al-Ti-Cr-Mn-V Medium-Entropy Alloys with High Strength and Ductility
2020 · Yu-Chin Liao, Po-Sung Chen, et al. · Entropy · 23
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Works count: 88
Citation count: 1,573
H-index: 24
I10-index: 41
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