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Author

Béla Bődi

Observed name: Béla Bodi
Institution: Obuda University
Observed institution: Obuda University
ORCID: 0009-0008-0117-085X
Observed ORCID: 0009-0008-0117-085X
OpenAlex ID: A5115841849
Thermal, Microstructural, and Morphological Analysis of Co-Ni-Ce Microalloyed SAC305 Lead-Free Solder Solidified at Low Cooling Rate
2026 · Béla Bődi, Viktor Gonda · Metals · 3
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Solidification Mechanisms and Microstructure of Bi-Alloyed Sn–Cu Solder at Low Cooling Rate
2026 · Béla Bődi, Viktor Gonda · IEEE Transactions on Components Packaging and Manufacturing Technology · 1
Microstructural evolution of Sn-Cu Based Bi Alloyed Lead-free Solder at Low Cooling Rate
2025 · Béla Bodi, Viktor Gonda · International Spring Seminar on Electronics Technology · 1
Characterization of Thermal Behavior of Lead-Free SAC305 Solder for Optimal Manufacturing in Soldering Processes
2024 · Béla Bődi, Viktor Gonda · IEEE International Conference and Workshop Óbuda on Electrical and Power Engineering (CANDO-EPE) · 1
Application Possibilities of PCB Rework at Large Manufacturers
2025 · Béla Bődi, Viktor Gonda · Advanced sciences and technologies for security applications
Works count: 5
Citation count: 6
H-index: 1
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