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Ajay Jaswal
Institution:
Central Manufacturing Technology Institute
Observed institution:
Central Manufacturing Technology Institute
ORCID:
0000-0002-8375-6457
Observed ORCID:
0000-0002-8375-6457
OpenAlex ID:
A5117278747
Study on the effect of substrate material on the mechanical strength of Cu bonds bonded through flip chip bonding
2024
·
N. Chaitra
, C. B. Harshitha
, et al.
·
Manufacturing Technology Today (MTT)
·
1
PDF
Optimization of gold wire bonding for sensor interconnects
2026
·
G. N Vikas
, Ajay Jaswal
, et al.
·
Manufacturing Technology Today (MTT)
PDF
Study on the effect of pivot position in hydrodynamic thrust bearing for minimum elastic distortion
2026
·
Ajay Jaswal
·
Manufacturing Technology Today (MTT)
PDF
Investigation of copper pillar flip-chip bonding failure: A case study on copper-to-copper interconnections
2025
·
Ajay Jaswal
, N Chaitra
, et al.
·
Engineering Failure Analysis
Advancements in x-ray microscopy for the non-destructive metallurgical characterization of mesoscale components
2025
·
Husna Jan
, Prabhanjan Kulkarni
, et al.
·
Manufacturing Technology Today (MTT)
PDF
Design and preliminary evaluation of a facial EMG–TENS wearable platform for trigeminal neuralgia therapy
2025
·
Manvantar R Girimaji
, Ajay Jaswal
, et al.
·
Manufacturing Technology Today (MTT)
PDF
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Works count:
6
Citation count:
1
H-index:
1
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