Author

Haiping Yang

Institution: Hubei Engineering University

Observed institution: Hubei Engineering University

ORCID: 0009-0002-5329-7875

Observed ORCID: 0009-0002-5329-7875

OpenAlex ID: A5121003186

Modulating mechanical properties of ultrathin electrolytic copper foils via synergistic effects of PEG, SPS and H1 additives

2026 · Haiping Yang, Meiling Liu, et al. · Applied Surface Science · 1

Regulation mechanism of tetrahydrothiazole thione additive in electroplated copper foil deposits: Synergistic optimization of mechanical properties and electrochemical behavior

2026 · Xiaowen Zhang, Zheng Yu, et al. · Journal of Materials Research and Technology

Regulation Mechanism of Tetrahydrothiazole Thione Additive in Electroplated Copper Foil Deposits: Synergistic Optimization of Mechanical Properties and Electrochemical Behavior

2025 · Feng Wang, Xiaowen Zhang, et al. · SSRN Electronic Journal

Works count: 3

Citation count: 1

H-index: 1

I10-index: