Author

Jinghong Chen

Institution: Kunming Institute of Precious Metals

Observed institutions: Wenzhou University, Kunming Institute of Precious Metals

ORCID: 0009-0006-2497-3319

Observed ORCID: 0009-0006-2497-3319

OpenAlex ID: A5122849977

Enhancing the microstructure and mechanical properties of NiV/Cu diffusion-bonded joints via a magnetron-sputtered Ni interlayer

2026 · Jingyu Li, Jinghong Chen, et al. · Vacuum · 1

Microstructure, sputtering performance, and film properties of Ag-1wt.%Cu alloy targets: A comparative study with pure Ag

2026 · Xin Li, Menghang Sun, et al. · Vacuum · 1

Enhancing the Microstructure and Mechanical Properties of NiV/Cu Diffusion-Bonded Joints via a Magnetron-Sputtered Ni Interlayer

2026 · Jingyu Li, Jinghong Chen, et al. · SSRN Electronic Journal

Enhancing the Microstructure and Mechanical Properties of NiV/Cu Diffusion-Bonded Joints via a Magnetron-Sputtered Ni Interlayer

2026 · Jingyu Li, Jinghong Chen, et al. · SSRN Electronic Journal

Works count: 5

Citation count: 3

H-index: 1

I10-index: