Author

Sang Won Yoon

Institution: Seoul National University

Observed institution: Seoul National University

ORCID: 0000-0002-0201-8031

Observed ORCID: 0000-0002-0201-8031

OpenAlex ID: A5124114488

Metal-Enhanced Waffle Wafer Design for Thermomechanical Warpage Reduction in Fan-Out Wafer-Level Packaging

2026 · Bonghak Lee, Sang Won Yoon · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 1

Stack-height-aware thermal management of HBM packages via selective NCF thermal conductivity strategy

2026 · Yuna Lee, Jeong Hun Song, et al. · Microelectronics Reliability

Modeling and Improvement of Heat-Flow Paths Inside 3D-nand First-Level Packages With Internal Metal Structures

2026 · Hobeom Han, Jung Su Yoon, et al. · IEEE Transactions on Electron Devices

Embedded PCB and DBC-integrated design of 650 V GaN power modules with enhanced thermal and electrical performance

2026 · A. Yeong Choi, Jaejin Jeon, et al. · Microelectronics Reliability

Improving Electrical and Thermal Performance of 650-V GaN E-HEMT Modules Using a Cover-All Meandered Thick-Copper (CAMT) Interconnection

2026 · Jihwan Seong, A. Yeong Choi, et al. · IEEE Access

Works count: 5

Citation count: 1

H-index: 1

I10-index: