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Xuemei Li
Institution:
Qiqihar University
Observed institution:
Qiqihar University
ORCID:
0000-0002-6256-7032
Observed ORCID:
0000-0002-6256-7032
OpenAlex ID:
A5125380725
Interfacial reaction behavior, microstructure, and shear property of Sn58Bi–xAg@Cu/Cu solder joints during thermal aging
2026
·
Zuchen Liu
, Xiangxia Kong
, et al.
·
Journal of Materials Science Materials in Electronics
·
3
Numerical Study on Dendritic Growth During Solidification in Vibration-Assisted GMAW of Q450NQR1 Steel Using a Coupled Temperature–Cellular Automaton Model
2026
·
Yachen Wei
, Dongyuan Lou
, et al.
·
Materials
Effect of Ni Addition on the Comprehensive Properties of Bi–2.6Ag– x Ni/Cu Solder Joints
2026
·
Xuemei Li
, Yupeng Su
, et al.
·
Advanced Engineering Materials
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Works count:
3
Citation count:
3
H-index:
1
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