Author

Jiaji Geng

Institution: Hebei University of Technology

Observed institution: Hebei University of Technology

ORCID: 0009-0008-1792-6746

Observed ORCID: 0009-0008-1792-6746

OpenAlex ID: A5126420646

Advances on the application of ceria nanoparticles in dielectric layer CMP and post-cleaning: structural control, modification strategies, and mechanistic studies

2026 · Wenyue Qi, Jiaji Geng, et al. · Materials Science in Semiconductor Processing · 1

Performance evaluation and mechanism analysis of a novel cleaning solution for particle and organic contamination on copper surface

2026 · Xvfei Zhu, Renhao Liu, et al. · Colloids and Surfaces A Physicochemical and Engineering Aspects · 1

Removal of CeO2 particles for SiO2/Si3N4 post-CMP with composite cleaning solution: Performance and synergistic mechanism

2026 · Wenyue Qi, Xinyu Han, et al. · Materials Science in Semiconductor Processing

Unraveling the structure-inhibition relationship of sulfur-containing azole inhibitors on copper surfaces: Experimental and theoretical insights into adsorption mechanisms

2026 · Jiaji Geng, Wenyue Qi, et al. · Materials Chemistry and Physics

Electrochemical insights into environment-dependent adsorption of potassium oleate on cobalt surface

2026 · Fangyuan Wang, Baimei Tan, et al. · Electrochimica Acta

Action mechanism of composite inhibitors on galvanic corrosion of copper interconnection ruthenium barrier layer from experimental and theoretical perspectives

2026 · Jiaji Geng, Xiaolong Wang, et al. · Thin Solid Films

Atomic level surface for silica and silicon nitride using ceria slurry with three kinds of dispersants

2026 · Wenyue Qi, Xinyu Zhao, et al. · Tribology International

Influence of Complexing Agents on the Material Removal Rate Selectivity in CMP for Copper Interconnects

2026 · Jiaji Geng, Wenyue Qi, et al. · ECS Journal of Solid State Science and Technology

Works count: 9

Citation count: 12

H-index: 1

I10-index: 1