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Juan Pu
Observed name:
Juan PU
Institutions:
Shanghai Polytechnic University,
Jiangsu University of Science and Technology,
China Agricultural University
Observed institutions:
Shanghai Polytechnic University,
Jiangsu University of Science and Technology,
China Agricultural University
ORCID:
0000-0001-9586-8942
Observed ORCID:
0000-0001-9586-8942
OpenAlex ID:
A5127792019
Welding Techniques and Microstructural Control for Dissimilar Cu/Al Joints
2026
·
Dong Jin
, Juan Pu
, et al.
·
Crystals
·
3
Effect of Ni Interlayer on Microstructure and Properties of C276 Hastelloy/Q235 Steel Cladding Plates
2026
·
Lin Lv
, Mingfang Wu
, et al.
·
Coatings
·
1
PDF
Finite element analysis of residual stress in fine-grained diamond powder during induction brazing
2026
·
Juan PU
, Haozhan JING
, et al.
·
DOAJ (DOAJ: Directory of Open Access Journals)
The influence of Cu/Zr foils composite interlayer on the microstructure and mechanical properties of the GH4169/Ti60 diffusion bonded joint
2026
·
Zhuoli Yu
, Shibo Zhu
, et al.
·
SSRN Electronic Journal
H9N2 Avian Influenza Viruses Dominant During 2021–2025: Enhanced Mammalian Pathogenicity, Airborne Transmissibility And Increased Zoonotic Risk
2026
·
Chuankuo Zhao
, Xue Chen
, et al.
·
SSRN Electronic Journal
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Works count:
5
Citation count:
4
H-index:
1
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