Author

Wenbo Luo

Institutions: University of Electronic Science and Technology of China, Changsha University, State Key Laboratory of Electronic Thin Films and Integrated Devices

Observed institutions: University of Electronic Science and Technology of China, Changsha University, State Key Laboratory of Electronic Thin Films and Integrated Devices

ORCID: 0000-0002-3528-2111

Observed ORCID: 0000-0002-3528-2111

OpenAlex ID: A5137673313

Review: diamond heterogeneous integration for thermal management—integration strategies and advanced packaging

2026 · Shihang Wu, Fugeng Wu, et al. · Journal of Materials Science

Influence of chain entanglements on slow crack growth resistance of polyethylene

2026 · Jiawei Liu, Wenbo Luo, et al. · Journal of Materials Science

Works count: 2

Citation count:

H-index:

I10-index: