Concept

Drop test

OpenAlex ID: C2775865969

A case study of ir-drop in structured at-speed testing

2004 · J. Saxena, K.M. Butler, et al. · IEEE International Test Conference (ITC) · 405

Compressive response of polymeric foams under quasi-static, medium and high strain rate conditions

2006 · Simon Ouellet, Duane Cronin, et al. · Polymer Testing · 318

Lightweight design and crash analysis of composite frontal impact energy absorbing structures

2011 · Jovan Obradovic, Simonetta Boria, et al. · Composite Structures · 265

Drop-weight impact of plain-woven hybrid glass–graphite/toughened epoxy composites

2009 · Ercan Sevkat, Benjamin Liaw, et al. · Composites Part A Applied Science and Manufacturing · 194

Impact life prediction modeling of TFBGA packages under board level drop test

2004 · Tong Yan Tee, Hun Shen Ng, et al. · Microelectronics Reliability · 193

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition

2005 · Yi-Shao Lai, Ping-Feng Yang, et al. · Microelectronics Reliability · 181

Statistical and experimental analysis on the behavior of fiber reinforced concretes subjected to drop weight test

2012 · Tara Rahmani, Behnam Kiani, et al. · Construction and Building Materials · 176

A review on the performance of conventional and energy-absorbing rockbolts

2014 · Charlie C. Li, Gisle Stjern, et al. · Journal of Rock Mechanics and Geotechnical Engineering · 168

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Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact

2004 · Tong Yan Tee, Jing-en Luan, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 161

Damage behavior of fiber reinforced composite plates subjected to drop weight impacts

2005 · Ramin Hosseinzadeh, Mahmood Mehrdad Shokrieh, et al. · Composites Science and Technology · 160

Numerical Analysis of Lateral Inertial Confinement Effects on Impact Test of Concrete Compressive Material Properties

2010 · Yifei Hao, Hong Hao, et al. · International Journal of Protective Structures · 158

Drop impact reliability testing for lead-free and lead-based soldered IC packages

2005 · Desmond Y.R. Chong, F.X. Che, et al. · Microelectronics Reliability · 158

Influence of drop weight geometry and interlayer on impact behavior of RC beams

2019 · Huawei Li, Wensu Chen, et al. · International Journal of Impact Engineering · 144

Effect of repeated impacts on the response of plain-woven hybrid composites

2010 · Ercan Sevkat, Benjamin Liaw, et al. · Composites Part B Engineering · 144

Electrically conductive adhesives for surface mount solder replacement

1996 · M. Zwolinski, J. Hickman, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part C · 144

Methodology to determine failure characteristics of planar soft tissues using a dynamic tensile test

2006 · C. Jacquemoud, K. Bruyere-Garnier, et al. · Journal of Biomechanics · 134

Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications

2016 · Vempati Srinivasa Rao, Chai Tai Chong, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 131

Rollover and Drop Tests - The Influence of Roof Strength on Injury Mechanics Using Belted Dummies

1990 · G.S. Bahling, R.T. Bundorf, et al. · SAE technical papers on CD-ROM/SAE technical paper series · 130

Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling

2007 · Pradeep Lall, Sameep Gupte, et al. · IEEE Transactions on Electronics Packaging Manufacturing · 124

Numerical Investigation of the Dynamic Compressive Behaviour of Rock Materials at High Strain Rate

2012 · Y. Hao, H. Hao · Rock Mechanics and Rock Engineering · 120

Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact

2004 · P. Lall, D. Panchagade, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 119

Factors influencing impact force profile and measurement accuracy in drop weight impact tests

2020 · Huawei Li, Wensu Chen, et al. · International Journal of Impact Engineering · 118

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A study of nanoparticles in Sn–Ag based lead free solders

2007 · Masazumi Amagai · Microelectronics Reliability · 112

Measurement, Analysis, and Comparison of the Parcel Shipping Shock and Drop Environment of the United States Postal Service with Commercial Carriers

2007 · J. Singh, S. P. Singh, et al. · Journal of Testing and Evaluation · 108

Board level drop test method of components for handheld electronicproduc ts

2006 · 108

Works count: 4,538

Citation count: 29,440