Texas Instruments (Singapore)

Alternate name: Texas Instruments Singapore Ltd

Parent institution: Texas Instruments (United States)

ROR: 037qn8k12

OpenAlex ID: I4405255617

Employing generalized audit software in the financial services sector

2005 · Roger Debreceny, Sook‐Leng Lee, et al. · Managerial Auditing Journal · 143

Predicting delamination in plastic IC packages and determining suitable mold compound properties

1994 · A.A.O. Tay, G.L. Tan, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 77

Residual stresses in plastic IC packages during surface mounting process preceded by moisture soaking test

1997 · Sung Yi, Jing Sua Goh, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 33

Artificial neural network model for analysis of power system harmonics

2002 · W.W.L. Keerthipala, Low Tah Chong, et al. · IEEE International Conference on Neural Networks/IEEE ... International Conference on Neural Networks · 28

A correlation study between different types of CDM testers and "real" manufacturing in-line leakage failures

1995 · M.D. Chaine, Chen Teck Liong, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 25

Non-destructive identification of defects in integrated circuit packages by scanning acoustic microscopy

1996 · Jicheng Yang · Microelectronics Reliability · 23

A criterion for predicting delamination in plastic IC packages

1993 · A.A.O. Tay, G.L. Tan, et al. · IEEE International Reliability Physics Symposium proceedings · 22

Spectroscopic photon emission measurements of n-channel MOSFETs biased into snapback breakdown using a continuous-pulsing transmission line technique

1997 · G L Teh, W K Chim, et al. · Semiconductor Science and Technology · 14

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Electrical failure analysis in high density DRAMs

2002 · A. Chan, D. Lam, et al. · Records of the IEEE International Workshop on Memory Technology, Design, and Testing · 12

Effects of mold compound properties on lead-on-chip (LOC) package reliability during IR reflow

2002 · Yang Ji-Chen, Leong Chew Weng, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 9

Low cost tactile gripper using silicone rubber sensor array

1988 · Lim Kah-Bin, Chong Yoon-Song · Robotica · 8

Perceptually lossless coder based on just noticeable distortion profile with subband dct

2005 · Ee-Leng Tan, Woon-Seng Gan, et al. · IEEE International Symposium on Consumer Electronics (ISCE) · 7

A modified lucky electron model for impact ionization rate in NMOSFET's at 77 K

1999 · C.H. Ling, L.K. See · IEEE Transactions on Electron Devices · 7

Machine vision for alignment and inspection in die bonder

1997 · Satish Kolloor, S. Balamurugan · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6

Fast Arbitrary Resizing of Images in DCT Domain

2007 · Ee-Leng Tan, Woon-Seng Gan, et al. · IEEE International Conference on Multimedia and Expo (ICME) · 5

Practical implementation of subband DCT based coder

2005 · Ee-Leng Tan, Woon-Seng Gan, et al. · International Symposium on Intelligent Signal Processing and Communication Systems (ISPACS) · 4

Fast image resizing in discrete cosine transform domain with spatial relationship between DCT block and its sub-blocks

2008 · Ee-Leng Tan, Woon-Seng Gan, et al. · International Conference on Audio, Language and Image Processing · 3

Finite element analysis of hygrothermally induced stresses in plastic IC packages

2002 · Sung Yi, Jing Sua Goh, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 3

Poly-3 bitline crack [DRAMs]

2002 · W. Tan, Lee Keat Peng, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 3

Effective tests for memories based on faults models for low PPM defects

2002 · D. Lam, S.Y. Khim · Records of the IEEE International Workshop on Memory Technology, Design, and Testing · 2

Perceptually tuned subband coder with region of interest

2007 · Ee-Leng, Tan, et al. · International Conference on Information, Communications & Signal Processing (ICICS) · 1

Fractographic analysis on the die surface crack of a LOC packaged DRAM

2002 · M. Mohanbabu, Swee Yong Khim, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 1

Double through-transmission ultrasonic inspection of plastic IC packages

2002 · Ji Cheng Yang, Jing Sua Goh · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 1

Modeling and characterization studies of parasitic elements in lead-on-chip thin-small-outline packaging

2002 · P.-H. Yee, S.-W. Low, et al. · IEMT/IMC Symposium

A study on accelerated preconditioning test

2002 · Y. Sun, E.C. Wong, et al. · Electronic Packaging Technology Conference

Works count: 32

Citation count: 661