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C.UYEMURA Co., Ltd. (Japan)

Homepage: uyemura.co.jp
Alternate names: C.UYEMURA, C.UYEMURA Co., Ltd., 上村工業株式会社
ROR: 02pabx538
OpenAlex ID: I4405264698
Interface microstructures between Ni-P alloy plating and Sn–Ag–(Cu) lead-free solders
2003 · Chi-Won Hwang, Katsuaki Suganuma, et al. · Journal of materials research/Pratt's guide to venture capital sources · 87
Robust bonding and thermal-stable Ag–Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less
2020 · Chuantong Chen, Zheng Zhang, et al. · Journal of Alloys and Compounds · 64
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Enhancement of bonding strength in Ag sinter joining on Au surface finished substrate by increasing Au grain-size
2019 · Zheng Zhang, Chuantong Chen, et al. · Applied Surface Science · 43
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Mitigation of Sn Whisker Growth by Small Bi Additions
2013 · Jung-Lae Jo, Shijo Nagao, et al. · Journal of Electronic Materials · 43
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Studies on Chemical Modification of Porous Silicon‐Based Graded‐Index Optical Microcavities for Improved Stability Under Alkaline Conditions
2012 · T. Jalkanen, E. Mäkilä, et al. · Advanced Functional Materials · 43
Interface reaction and evolution of micron-sized Ag particles paste joining on electroless Ni-/Pd-/Au-finished DBA and DBC substrates during extreme thermal shock test
2021 · Chuantong Chen, Zheng Zhang, et al. · Journal of Alloys and Compounds · 36
Electrolysis using composite-plated electrodes
1990 · Yoshihito Kunugi, Toshio Fuchigami, et al. · Journal of Electroanalytical Chemistry · 32
Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock
2022 · Yang Liu, Chuantong Chen, et al. · Materials & Design · 30
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Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers
2007 · Shih-Kang Lin, Yuhi Yorikado, et al. · Journal of Electronic Materials · 25
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Transparent Conducting and Highly Stable Indium-Incorporated Zinc Oxide Film Prepared by Chemical Reactions
2003 · Masanobu Izaki, Yoshikazu Saijo · Journal of The Electrochemical Society · 22
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Least lead addition to mitigate tin whisker for ambient storage
2013 · Jung-Lae Jo, Keun-Soo Kim, et al. · Journal of Materials Science Materials in Electronics · 21
Effect of Phosphorus Content on Hydrogen Embrittlement for High Strength Steel Treated with Electroless Ni–P Plating
2020 · Makoto Hino, Yuho Doi, et al. · MATERIALS TRANSACTIONS · 20
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Novel Cu plating formula for filling through silicon vias
2009 · Shao-Ping Shen, Wei-Ping Dow, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 16
Hydrophilic Surface Modification and Metallization of Poly(tetrafluoroethylene) Film by Excimer Laser Processing
1995 · Hiroyuki Niino, Toshinori Murao, et al. · Molecular crystals and liquid crystals science technology. Section A, Molecular crystals and liquid crystals/Molecular crystals and liquid crystals science and technology. Section A, Molecular crystals and liquid crystals · 15
Amorphization of electrodeposited FeW alloy films and electrochemical behavior
1990 · Yongfeng Ruan, Suwei Yao, et al. · Journal of Non-Crystalline Solids · 15
Effect of Electroless Ni–P Plating on Rotary Bending Fatigue Strength of A2017-T4 Aluminum Alloy
2022 · Ryohei Shinno, Makoto Hino, et al. · MATERIALS TRANSACTIONS · 12
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Intermetallic Compound Growth between Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Sn-3.5Ag or Sn-3.0Ag-0.5Cu Solder
2018 · Yukinori Oda, Naoki Fukumuro, et al. · Journal of Electronic Materials · 12
Sn whisker growth on Sn plating with or without surface treatment during the room temperature exposure
2013 · Keun-Soo Kim, Sun-Sik Kim, et al. · Journal of Alloys and Compounds · 12
Prominent interface structure and bonding material of power module for high temperature operation
2017 · Kazuhiko Sugiura, Tomohito Iwashige, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 11
CFD analysis of eductor agitation in electroplating tank
2010 · L. Z. Tong, K. Ohara, et al. · Transactions of the IMF · 10
Initiation Process of Film Formation for Cationic Electropaint System
2000 · Yo-ichiro Suzuki, Hirokazu Fukui, et al. · Journal of The Electrochemical Society · 10
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CoW metallization for high strength bonding to both sintered Ag joints and encapsulation resins
2019 · Tomohito Iwashige, Takeshi Endo, et al. · Journal of Materials Science Materials in Electronics · 9
Thermal stress driven Sn whisker growth: in air and in vacuum
2013 · Jung-Lae Jo, Shijo Nagao, et al. · Journal of Materials Science Materials in Electronics · 9
Molecular dynamics—Monte Carlo hybrid simulation of thin film growth and void formation in electrodeposition process
2007 · Yasuaki Hiwatari, Yutaka Kaneko, et al. · Molecular Simulation · 9
Computer simulation of electrodeposition: hybrid of molecular dynamics and Monte Carlo
2004 · Yutaka Kaneko, Takashi Mikami, et al. · Molecular Simulation · 9
Works count: 230
Citation count: 1,553
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