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Shinko Electric Co., Ltd. (Japan)
Homepage:
sinfo-t.jp
Alternate names:
Shinko Electric,
Shinko Electric Co., Ltd.,
Sinfonia Technology Co., Ltd.,
シンフォニアテクノロジー株式会社,
神鋼電機株式会社
ROR:
03bb99324
OpenAlex ID:
I4405275304
Applying Quality Function Deployment to environmentally conscious design
2003
·
Keijiro Masui
, Tomohiko Sakao
, et al.
·
International Journal of Quality & Reliability Management
·
247
Silicon interposer with TSVs (Through Silicon Vias) and fine multilayer wiring
2008
·
Masahiro Sunohara
, Takayuki Tokunaga
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
158
Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps
2014
·
Kiyoshi Oi
, Satoshi Otake
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
150
Analysis and comparison of PM synchronous motor and induction motor type magnetic bearings
1995
·
Y. Okada
, K. Dejima
, et al.
·
IEEE Transactions on Industry Applications
·
87
Electrochemical Power Generation Directly from Combustion Flame of Gases, Liquids, and Solids
2004
·
Michio Horiuchi
, Shigeaki Suganuma
, et al.
·
Journal of The Electrochemical Society
·
75
Development of Organic Multi Chip Package for High Performance Application
2013
·
Noriyoshi Shimizu
, Wataru Kaneda
, et al.
·
IMAPSource Proceedings
·
72
Feasible development of soft-switched SIT inverter with load-adaptive frequency-tracking control scheme for induction heating
1998
·
A. Okuno
, H. Kawano
, et al.
·
IEEE Transactions on Industry Applications
·
65
Development of 2.3D High Density Organic Package using Low Temperature Bonding Process with Sn-Bi Solder
2019
·
Shota Miki
, Hiroshi Taneda
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
64
Studies on electrical performance and thermal stress of a silicon interposer with TSVs
2010
·
Masahiro Sunohara
, Hideaki Sakaguchi
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
55
A Novel Blue Light Emitting Material Prepared from 2-(o-Hydroxyphenyl)benzoxazole
1994
·
Norikazu Nakamura
, Shinichi Wakabayashi
, et al.
·
Chemistry Letters
·
48
Thermal tuning of mechanically induced long-period fiber grating
2005
·
Takashi Yokouchi
, Yoshifumi Suzaki
, et al.
·
Applied Optics
·
44
Preparation of Cu-doped TiO2 via refluxing of alkoxide solution and its photocatalytic properties
2011
·
Hiromasa Nishikiori
, Takashi Sato
, et al.
·
Research on Chemical Intermediates
·
38
Electro-migration evaluation between organic interposer and build-up substrate on 2.3D organic package
2020
·
Kei Murayama
, Shota Miki
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
33
Investigation of evolution strategy and optimization of induction heating model
2000
·
T. Narita
, N. Takahashi
, et al.
·
IEEE Transactions on Magnetics
·
32
PDF
Direct-Flame Solid-Oxide Fuel Cell (DFFC): A Thermally Self-Sustained, Air Self- Breathing, Hydrocarbon-Operated SOFC System in a Simple, No-Chamber Setup
2007
·
Marcel Vogler
, Daniel Barzan
, et al.
·
ECS Transactions
·
30
PDF
Development of silicon module with TSVs and global wiring (L/S=0.8/0.8µm)
2009
·
Masahiro Sunohara
, Akinori Shiraishi
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
28
Preparation and characterization of CuInS2 thin films solar cells with large grain
2001
·
Yoshio Onuma
, Kenji Takeuchi
, et al.
·
Solar Energy Materials and Solar Cells
·
27
Thermal analysis of plastic QFP with high thermal dissipation
2003
·
M. Tanaka
, Y. Takeuchi
·
IEEE Electronic Components and Technology Conference (ECTC)
·
26
Magnetically Levitated Motor for Rotary Blood Pumps
1997
·
Yohji Okada
, Satoshi Ueno
, et al.
·
Artificial Organs
·
26
High-frequency inverter with phase-shifted PWM and load-adaptive PFM control strategy for industrial induction-heating
2002
·
S. Nagai
, H. Nagura
, et al.
·
IEEE Industry Applications Society Annual Meeting (IAS)
·
23
Development of Si interposer with low inductance decoupling capacitor
2011
·
Akihito Takano
, Masahiro Sunohara
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
21
Evaluation of Mechanical Stress Induced During IC Packaging
2018
·
Vladimir Cherman
, Melina Lofrano
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
18
Light-weight type linear induction motor and its characteristics
1992
·
S. Osawa
, M. Wada
, et al.
·
IEEE Transactions on Magnetics
·
18
Closed-Surface Multifunctional Antireflective Coating Made from SiO2 with TiO2 Nanocomposites
2021
·
Zhiqiu Guo
, Ze Zhu
, et al.
·
Materials
·
16
PDF
Quality function deployment for environment: QFDE (2nd report)-verifying the applicability by two case studies
2002
·
T. Sakao
, K. Masui
, et al.
·
International Symposium on Environmentally Conscious Design and Inverse Manufacturing (EcoDesign)
·
16
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Works count:
356
Citation count:
7,027
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