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Research Association for Advanced Systems

Homepage: raas-cip.org
Alternate name: 先端システム技術研究組合
ROR: 01cftye63
OpenAlex ID: I4405283282
A 7-nm FinFET 1.2-TB/s/mm2 3D-Stacked SRAM Module With 0.7-pJ/b Inductive Coupling Interface Using Over-SRAM Coil and Manchester-Encoded Synchronous Transceiver
2022 · Kota Shiba, Mitsuji Okada, et al. · IEEE Journal of Solid-State Circuits · 17
Hydrophilic Bonding of SiO2/SiO2 and Cu/Cu using Sequential Plasma Activation
2023 · Kai Takeuchi, Takeki Ninomiya, et al. · ECS Transactions · 12
A 12.8-Gb/s 0.5-pJ/b Encoding-Less Inductive Coupling Interface Achieving 111-GB/s/W 3D-Stacked SRAM in 7-nm FinFET
2023 · Kota Shiba, Mitsuji Okada, et al. · IEEE Solid-State Circuits Letters · 10
A 7-nm FinFET 1.2-TB/s/mm2 3D-Stacked SRAM with an Inductive Coupling Interface Using Over-SRAM Coils and Manchester-Encoded Synchronous Transceivers
2022 · Kota Shiba, Mitsuji Okada, et al. · IEEE Hot Chips Symposium · 3
Hydrophilic Bonding of SiO2/SiO2 and Cu/Cu using Sequential Plasma Activation
2023 · Kai Takeuchi, Takeki Ninomiya, et al. · ECS Meeting Abstracts · 2
AlN Gap-Fill Process by Aerosol Deposition Method for Application in 3D-IC Packaging
2025 · Takeki Ninomiya, Takeshi Takagi, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1
Introduction of thick AlN coating on Si for 3D-IC thermal management
2024 · Takeki Ninomiya, Takeshi Takagi, et al. · Japanese Journal of Applied Physics · 1
A 12.8-Gbps 0.5-pJ/b Encoding-less Inductive Coupling Interface Using Clocked Hysteresis Comparator for 3D-stacked SRAM in 7-nm FinFET
2022 · Kota Shiba, Mitsuji Okada, et al. · IEEE Asian Solid-State Circuits Conference (A-SSCC) · 1
Works count: 8
Citation count: 244
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