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Meltex (Japan)

Homepage: meltex.com
Alternate name: メルテックス
ROR: 01hjfhh52
OpenAlex ID: I4405283369
Void-Free Copper Filling of Through Silicon Via by Periodic Pulse Reverse Electrodeposition
2014 · Q. S. Zhu, A. Toda, et al. · Journal of The Electrochemical Society · 61
Effect of Solution Composition on Double Zincate Process of Aluminum.
1996 · Kazuhisa AZUMI, Yusuke FUJISHIGE, et al. · Journal of The Surface Finishing Society of Japan · 27
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Relationship between Pretreatment and Initial Deposition in Electroless Nickel Plating on Aluminum Substrate.
1994 · Katsuhiko TASHIRO, Kunio CHIBA, et al. · Journal of The Surface Finishing Society of Japan · 25
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Effect of Copper Pretreatment on the Double Zincate Process of Aluminum Alloy Films
2007 · Kazuhisa Azumi, Shinnosuke Egoshi, et al. · Journal of The Electrochemical Society · 22
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Electroless Deposition of Ni–Sn–P and Ni–Sn–Cu–P Coatings
2005 · J. Georgieva, S. Kawashima, et al. · Journal of The Electrochemical Society · 19
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Effect of in-situ electroless plating on friction and wear of metals
2003 · K. Hiratsuka, Y. Abe, et al. · Wear · 15
Fully-Filled, Highly-Reliable Fine-Pitch Interposers with TSV Aspect Ratio >10 for Future 3D-LSI/IC Packaging
2019 · Murugesan Murugesan, Takafumi Fukushima, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 14
Nickel Plating on Silicon for Fabricating an Infrared Wire-Grid Polarizer
2010 · Mitsunori Saito, Tatsuya Yamamoto, et al. · Japanese Journal of Applied Physics · 14
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Novel MEMS-based fabrication technology of micro solenoid-type inductor
2013 · S Uchiyama, Z Q Yang, et al. · Journal of Micromechanics and Microengineering · 12
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Effect of Electroless Nickel/Immersion Gold Finishing on BGA Solder Joints.
2001 · Takashi SUGIZAKI, Kazutaka TAJIMA, et al. · Journal of The Japan Institute of Electronics Packaging · 12
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Experimental Simulation for Zincate Pretreatment of Al Pad Connected to LSI Circuit
2003 · Kazuhisa AZUMI, Yuichi KOYAMA, et al. · Journal of The Surface Finishing Society of Japan · 11
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Influence of Basic Component of plating Bath. Role of Basic Composition for Deposits. Electroless Nickel Bath.
1999 · Katsuhiko TASHIRO · Journal of The Surface Finishing Society of Japan · 10
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Surface Pretreatment Effects on Zn Deposition in Zincate Process of Aluminum Alloy.
1997 · Kazuhisa AZUMI, Yusuke FUJISHIGE, et al. · Journal of The Surface Finishing Society of Japan · 10
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プリント配線板と表面処理（Ｉ）実装用表面処理：無電解Ｎｉ／無電解Ｐｄ／置換金めっき（ＥＮＥＰＩＧ）
2011 · Kazutaka TAJIMA · Journal of The Surface Finishing Society of Japan · 9
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Preparation and It's Properties of High Resistivity NiP Films by Means of Electroless Deposition.
1996 · Takuro HATSUKAWA, Taichi HIGASHIKAWA, et al. · Journal of The Surface Finishing Society of Japan · 9
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Pyrimidine derivative-based cyanide-free silver electroplating bath
2022 · Atiqah Binti Jasni, Sachio Yoshihara, et al. · Transactions of the IMF · 8
Reduction of core loss in non-oriented (NO) electrical steel by electroless-plated magnetic coating
2010 · Pornthep Chivavibul, Manabu Enoki, et al. · Journal of Magnetism and Magnetic Materials · 8
BGA Jointing Property of Sn-8.8 mass%Zn and Sn-8.0 mass%Zn-3.0 mass%Bi Solder on Electroless Nickel-Phosphorus/Immersion Gold Plated Substrates
2003 · Takashi Sugizaki, Hidehiro Nakao, et al. · MATERIALS TRANSACTIONS · 8
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Evaluation Methods of Solder Wettability
2007 · Hideyuki SAMPEI · Journal of The Surface Finishing Society of Japan · 7
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Electrodeposition of Silver in Cyanide-Free Solution Containing Pyrimidine Derivative as a Complexing Agent
2023 · Atiqah Binti Jasni, Sachio Yoshihara · Journal of The Electrochemical Society · 6
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Advanced Chemical Processes for Semi-additive PWB fabrication for Fine Line Formation Targeting Line and Space=5μm/5μm
2015 · Satoshi Kawashima, Kazutaka Tajima · IMAPSource Proceedings · 6
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High-Speed Copper Filling within High Aspect Ratio Through Holes in Polymer Substrates
2013 · Q.S. Zhu, A. Toda, et al. · International Journal of Electrochemical Science · 6
Effects of Plating Conditions on Electroless Ni–Co–P Coating Prepared from Lactate-Citrate-Ammonia Solution
2013 · Akira Toda, Pornthep Chivavibul, et al. · MATERIALS TRANSACTIONS · 6
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Analysis of Joining Boundary between Ni-P Electroless Plate and Solder by EPMA Scatter Diagram Method (I)
2004 · Takashi Kimura, Takashi Sugizaki, et al. · Journal of the Japan Institute of Metals and Materials · 6
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An interventional flexible microneedle with three-electrode system on the capillary for continuous glucose monitoring and drug delivery
2013 · Z. Yang, A. Toda, et al. · International Conference on Solid-State Sensors, Actuators and Microsystems · 5
Works count: 85
Citation count: 792
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