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Electronic Components and Materials

Source type: journal
Alternate names: Dianzi Yuanjian yu Cailiao, 电子元件与材料
Fully OA: No
DOAJ: No
OpenAlex ID: S2764887705
Electronic components and materials.
2000 · Qu Xi · Electronic Components and Materials · 116
Development of Low Dielectric Constant Calcium Silicate Fired at Low Temperature
2002 · Yan Li · Electronic Components and Materials · 9
Research progress of microwave absorption materials
2015 · Pang Jianfen · Electronic Components and Materials · 8
Froth flotation technology for separation of Si and SiC powders in wire saw slurry from silicon wafering process
2010 · Lang Zhou · Electronic Components and Materials · 8
Research progress on lithium-ion power battery life prediction
2009 · Zidong Wang · Electronic Components and Materials · 7
Principles and applications of supercapacitors
2008 · Ying-Fang Chen, LI Yuan-yuan, et al. · Electronic Components and Materials · 6
Natural corrosion and electrical contact property of gold plating on contacts.
2001 · Ji-Gao Zhang · Electronic Components and Materials · 6
Recent progress of perovskite solar cells
2014 · Zhang Wei-ha · Electronic Components and Materials · 5
Research on the varying of nonlinear coefficient during the degradation of ZnO varistor
2011 · RU Hongbo · Electronic Components and Materials · 5
Analysis of the Sensitive Mechanism of the Gas Pendulum Tilt Sensor by Finite Element Method
2003 · Fuxue Zhang · Electronic Components and Materials · 5
Research progress of electromagnetic metamaterial absorber
2011 · Zhang Huai-wu · Electronic Components and Materials · 4
Analysis on the thermal fatigue life of PoP using finite element method
2011 · Chao Ren, Cheng Luo, et al. · Electronic Components and Materials · 4
Preparation of ultra-fine silver powder used in electronic paste by chemical reduction
2010 · Huan Liu · Electronic Components and Materials · 4
Prediction of fatigue life of packaging EMC material based on BP neural networks
2008 · YI Fu-xi · Electronic Components and Materials · 4
Research progress on thermoelectric cooling technology applied in electronic packaging thermal management
2008 · Dongsheng Zhu · Electronic Components and Materials · 4
Electromigration suppressing effect of Ni particle on SnBi soldering point
2008 · Fu Guo · Electronic Components and Materials · 4
Study progress of preparation methods of hexagonal boron nitride
2008 · Tai Qiu · Electronic Components and Materials · 4
Reason analyse of causing breakdown of MLCC
2008 · Gui Di, Fei Sun, et al. · Electronic Components and Materials · 4
Surface Tension and Wetting Behavior of Sn-Zn-Bi Lead-free Solders
2005 · Feng Xue · Electronic Components and Materials · 4
Fundamental Study of SiCp/Al Composites in Electronic Packaging Applications
2003 · Ziyang Xiu · Electronic Components and Materials · 4
Progress in the Study on the Lead-free Solder and Its Reliability
2003 · Lang Zhou · Electronic Components and Materials · 4
A Study on Failure Mode and Reliability of Liquid Aluminum Electrolytic Capacitor
2002 · Ji Rui · Electronic Components and Materials · 4
Thermo-effect simulation and reliability analysis of lead-free micro solder joints
2016 · Hu Jiaxin · Electronic Components and Materials · 3
Developments of copper-to-copper low temperature bonding technology for 3D packaging
2015 · LI Ke-chen · Electronic Components and Materials · 3
Research on a temperature controlled terahertz wave absorber based on VO_2 media
2014 · LI Jia-bi · Electronic Components and Materials · 3
Works count: 2,804
Citation count: 767
H-index: 6
I10-index: 1
2yr mean citedness:
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