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IEEE Transactions on Components Hybrids and Manufacturing Technology

ISSNs: 0148-6411, 1558-3082
Source type: journal
Alternate name: Institute of Electrical and Electronics Engineers transactions on components, hybrids, and manufacturing technology
Fully OA: No
DOAJ: No
OpenAlex ID: S3582665
S-parameter-based IC interconnect transmission line characterization
1992 · W.R. Eisenstadt, Y. Eo · IEEE Transactions on Components Hybrids and Manufacturing Technology · 638
Constitutive relations for tin-based solder joints
1992 · R. Darveaux, K. Banerji · IEEE Transactions on Components Hybrids and Manufacturing Technology · 475
Heat sink optimization with application to microchannels
1992 · R.W. Knight, D.J. Hall, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 409
Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling
1983 · W. Engelmaier · IEEE Transactions on Components Hybrids and Manufacturing Technology · 375
Fatigue of 60/40 Solder
1986 · H. Solomon · IEEE Transactions on Components Hybrids and Manufacturing Technology · 300
High-speed VLSI interconnect modeling based on S-parameter measurements
1993 · Y. Eo, W.R. Eisenstadt · IEEE Transactions on Components Hybrids and Manufacturing Technology · 288
Survey of Contact Fretting in Electrical Connectors
1985 · M. Antler · IEEE Transactions on Components Hybrids and Manufacturing Technology · 237
Aluminum Nitride-An Alternative Ceramic Substrate for High Power Applications in Microcircuits
1984 · W. Werdecker, F. Aldinger · IEEE Transactions on Components Hybrids and Manufacturing Technology · 200
Quality Control Techniques for "Zero Defects"
1983 · T. Calvin · IEEE Transactions on Components Hybrids and Manufacturing Technology · 186
Metallic Electromigration Phenomena
1988 · S.J. Krumbein · IEEE Transactions on Components Hybrids and Manufacturing Technology · 174
Constitutive relation and creep-fatigue life model for eutectic tin-lead solder
1990 · S. Knecht, L.R. Fox · IEEE Transactions on Components Hybrids and Manufacturing Technology · 149
Performance of Hierarchical Production Scheduling Policy
1984 · R. Akella, Yong Choong, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 143
Copper/polyimide Materials System for High Performance Packaging
1984 · R. Jensen, J. Cummings, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 141
A new bonding technology using gold and tin multilayer composite structures
1991 · C.C. Lee, C.Y. Wang, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 134
Design Consideration in High Temperature Analog CMOS Integrated Circuits
1986 · F. Shoucair · IEEE Transactions on Components Hybrids and Manufacturing Technology · 131
Enhancement of flip-chip fatigue life by encapsulation
1991 · D. Suryanarayana, R. Hsiao, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 129
High thermal conductivity aluminum nitride ceramic substrates and packages
1990 · F. Miyashiro, N. Iwase, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 128
Self-aligned flip-chip assembly of protonic devices with electrical and optical connections
1990 · M.J. Wale, C. Edge · IEEE Transactions on Components Hybrids and Manufacturing Technology · 128
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
2021 · Institute of Electrical and Electronics Engineers · IEEE Transactions on Components Hybrids and Manufacturing Technology · 127
Au-In bonding below the eutectic temperature
1993 · C.C. Lee, C.Y. Wang, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 122
The development and performance characteristics of mixed flowing gas test environment
1988 · W.H. Abbott · IEEE Transactions on Components Hybrids and Manufacturing Technology · 122
A1N Substrates with High Thermal Conductivity
1985 · Y. Kurokawa, K. Utsumi, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 122
Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards
1984 · P. Hall · IEEE Transactions on Components Hybrids and Manufacturing Technology · 122
The influence of composition and Cr particle size of Cu/Cr contacts on chopping current, contact resistance, and breakdown voltage in vacuum interrupters
1989 · W.F. Rieder, M. Schussek, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 115
Evaluation of piezoresistive coefficient variation in silicon stress sensors using a four-point bending test fixture
1992 · R.E. Beaty, R.C. Jaeger, et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 112
Works count: 1,700
Citation count: 29,520
H-index: 70
I10-index: 780
2yr mean citedness:
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