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IEEE Transactions on Components Packaging and Manufacturing Technology Part B

ISSNs: 1070-9894, 1558-3686
Source type: journal
Alternate names: Advanced packaging, Components, packaging, and manufacturing technology, Transactions on components, packaging, and manufacturing technology.
Fully OA: No
DOAJ: No
OpenAlex ID: S3606648
A review of 3-D packaging technology
1998 · S.F. Al-Sarawi, D. Abbott, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 383
Modeling and analysis of multichip module power supply planes
1995 · Keunmyung Lee, A. Barber · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 181
Interconnect and circuit modeling techniques for full-chip power supply noise analysis
1998 · H.H. Chen, J.S. Neely · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 174
Analysis of the flow of encapsulant during underfill encapsulation of flip-chips
1997 · Sejin Han, K.K. Wang · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 160
Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates
1996 · Zonghe Lai, Johan Liu · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 157
Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints
1997 · P.L. Tu, Y.C. Chan, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 151
Characterization of thin film microstrip lines on polyimide
1998 · G.E. Ponchak, A.N. Downey · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 123
Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibrational conditions
1996 · J.H. Lau · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 111
Electrically conductive adhesives: a prospective alternative for SMD soldering?
1995 · J.C. Jagt, P.J.M. Beris, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 111
A novel integrated decoupling capacitor for MCM-L technology
1998 · P. Chahal, R.R. Tummala, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 103
Errors associated with the design, calibration and application of piezoresistive stress sensors in (100) silicon
1994 · R.C. Jaeger, J.C. Suhling, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 102
Efficient transient simulation of high-speed interconnects characterized by sampled data
1998 · W.T. Beyene, J.E. Schutt-Aine · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 101
Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs
1996 · G. Kelly, C. Lyden, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 94
Modeling, simulation, and measurement of mid-frequency simultaneous switching noise in computer systems
1998 · W.D. Becker, J. Eckhardt, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 88
Reliability studies of surface mount solder joints - effect of Cu-Sn intermetallic compounds
1996 · A.C.K. So, Y.C. Chan · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 88
Effect of CMOS driver loading conditions on simultaneous switching noise
1994 · A. Vaidyanath, B. Thoroddsen, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 84
Modeling, measurement, and simulation of simultaneous switching noise
1996 · B.D. McCredie, W.D. Becker · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 80
Predicting delamination in plastic IC packages and determining suitable mold compound properties
1994 · A.A.O. Tay, G.L. Tan, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 78
Design of solder joints for self-aligned optoelectronic assemblies
1995 · Wei Lin, S.K. Patra, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 75
Effect of PCB finish on the reliability and wettability of ball grid array packages
1996 · E. Bradley, K. Banerji · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 72
The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound
1997 · Soon-Jin Cho, Kyung-Wook Paik, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 70
Evaluation of contact resistance for isotropic electrically conductive adhesives
1995 · M.A. Gaynes, R.H. Lewis, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 69
A structured testability approach for multi-chip modules based on BIST and boundary-scan
1994 · Y. Zorian · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 69
Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder joints
1997 · Y.C. Chan, P.L. Tu, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 67
Efficient frequency-domain modeling and circuit simulation of transmission lines
1994 · L.M. Silveira, I.M. Elfadel, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 65
Works count: 416
Citation count: 8,887
H-index: 47
I10-index: 234
2yr mean citedness:
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