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IEEE/CPMT International Electronics Manufacturing Technology Symposium

ISSNs: 1089-8190, 2576-9626
Source type: conference
Alternate names: Proceedings IEMT symposium, IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT), Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330), Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146), Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205), [1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium, 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT), 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT), IEEE/CHMT International Electronics Manufacturing Technology Symposium (IEMT), IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), IEEE/CPMT/SEMI. 28th International Electronics Manufacturing Technology Symposium (Cat. No.03CH37479), IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585), IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (IEMT), IEEE International Electronics Manufacturing Technology Conference (IEMT), International Electronics Manufacturing Technology Symposium
Fully OA: No
DOAJ: No
OpenAlex ID: S4210209648
Embedded Wafer Level Ball Grid Array (eWLB)
2008 · M. Brunnbauer, T. Meyer, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 159
Run by run control of chemical-mechanical polishing
2002 · D. Boning, W. Moyne, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 87
3D packaging: where all technologies come together
2004 · M. Karnezos · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 79
Finite element based solder joint fatigue life predictions for a same die size-stacked-chip scale-ball grid array package
2003 · B.A. Zahn · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 73
A graph-based disassembly sequence planning for EOL product recycling
2002 · H.C. Zhang, T.C. Kuo · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 57
Shear testing and failure mode analysis for evaluation of BGA ball attachment
2003 · R. Erich, R.J. Coyle, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 56
Critical variables of solder paste stencil printing for micro-BGA and fine pitch QFP
2003 · Jianbiao Pan, G.L. Tonkay, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 52
Next generation electronics packaging utilizing flip chip technology
2004 · G. Pascariu, P. Cronin, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 48
A parametric study of flip chip reliability based on solder fatigue modelling
2002 · S.F. Popelar · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 48
Investigations of Au-Sn alloys on different end-metallizations for high temperature applications [solders]
2002 · S. Anhock, H. Oppermann, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 42
Encapsulation Of Flip Chip Structures
2005 · S.C. Machuga, S.E. Lindsey, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 41
Thermosonic ball bonding: friction model based on integrated microsensor measurements
2003 · J. Schwizer, M. Mayer, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 41
Solder joint reliability of fine pitch surface mount technology assemblies
2003 · J. Lau, L. Powers, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 40
A graph-based approach to disassembly model for end-of-life product recycling
2002 · H.C. Zhang, T.C. Kuo · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 40
Parallel test reduces cost of test more effectively than just a cheap tester
2004 · J. Rivoir · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 39
Effect of voids on the reliability of BGA/CSP solder joints
2002 · M. Yunus, A. Primavera, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 39
Gold stud bump in flip-chip applications
2003 · J. Jordan · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 38
Correlating solder paste composition with stencil printing performance
2003 · T.A. Nguty, N.N. Ekere, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 38
Optical leak detection for wafer level hermeticity testing
2004 · G. Elger, L. Shiv, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 34
A new LSI bonding technology 'Micron bump bonding assembly technology'
1988 · K. Hatada, H. Fujimoto, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 32
Optimizing the wafer dicing process
2002 · U. Efrat · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 31
Hierarchical real-time scheduling of a semiconductor fabrication facility
2002 · X. Bai, N. Srivatsan, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 30
Knowledge acquisition of manufacturing descriptions
1988 · W.M. Chapman · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 30
Environmental friendly package development by using copper wirebonding
2010 · CL Gan, TT Toong, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 29
Meeting the assembly challenges in new semiconductor packaging trend
2010 · Lim Lay Yeap · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 27
Works count: 2,379
Citation count: 8,116
H-index: 27
I10-index: 215
2yr mean citedness: 0.345
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