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Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology

Source type: journal
Publisher:
Fully OA: No
DOAJ: No
OpenAlex ID: S4306509110
To Slip or Not to Slip: Water Flows in Hydrophilic and Hydrophobic Microchannels
2002 · Chang-Hwan Choi, K. Johan A. Westin, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 64
Thermal Transport Phenomena in Buoyancy-Driven Nanofluids
2004 · A. G. Agwu Nnanna, Tom Fistrovich, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 37
Pumped Liquid Multiphase Cooling
2004 · Robert Hannemann, Joseph Marsala, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 36
Clumping and Packing of Hair Arrays Manufactured by Nanocasting
2004 · Carmel Majidi, Richard Groff, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 30
Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls
2002 · S. W. Ricky Lee, Yat-Kit Tsui, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 29
Low-Temperature Sintering of Nanoscale Silver Pastes for High-Performance and Highly-Reliable Device Interconnection
2005 · John G. Bai, Zach Z. Zhang, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 28
A Split-Flux Model for Phonon Transport Near Hotspots
2004 · S. Sinha, E. Pop, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 28
Liquid Metal Based Miniaturized Chip-Cooling Device Driven by Electromagnetic Pump
2005 · Jing Liu, Yi-Xin Zhou, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 27
Realizing 3-D Interconnected Direct Write Electronics Within Smart Stereolithography Structures
2005 · Jeremy A. Palmer, Jeffrey L. Summers, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 26
Thermal Contact Conductance Enhancement With Carbon Nanotube Arrays
2004 · Jun Xu, Timothy S. Fisher · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 19
Molecular Dynamics Study of Thermal Boundary Resistance: Evidence of Strong Inelastic Scattering Transport Channels
2004 · Robert J. Stevens, Pamela M. Norris, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 19
Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When High Powered Racks are Situated Amongst Lower Powered Racks
2002 · Roger Schmidt, Ethan Cruz · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 18
Underfill Assessments and Validations for Low-k FCBGA
2006 · Nicholas Kao, Jeng Yuan Lai, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 17
Development of Conformal PDMS and Parylene Coatings for Microelectronics and MEMS Packaging
2005 · Hyungsuk Lee, Junghyun Cho · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 17
Methodologies for Prognostication and Health Monitoring of Leaded and Lead Free Electronics and MEMS Packages in Harsh Environments
2005 · Pradeep Lall, Nokibul Islam, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 16
Examination of the Slip Boundary Condition by µ-PIV and Lattice Boltzmann Simulations
2002 · Derek C. Tretheway, Luoding Zhu, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 16
Vibration Durability Comparison of Sn37Pb vs SnAgCu Solders
2006 · Yuxun Zhou, Estelle Scanff, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 13
Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics
2004 · Xiaojin Wei, Yogendra Joshi, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 12
Thermal Conductivity of Single-Wall Carbon Nanotubes
2004 · Hongliang Zhong, Jennifer R. Lukes · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 12
A Wafer-Level Vacuum Packaging Technology Utilizing Electroplated Nickel
2002 · Brian H. Stark, Khalil Najafi · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 11
Effect of Dwell Times and Ramp Rates on the Thermal Cycling Reliability of Pb-Free Wafer-Level Chip Scale Packages: Experiments and Modeling
2006 · S. Chaparala, J. M. Pitarresi, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 10
Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction
2002 · Krishna Tunga, James Pyland, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 10
Mechanical Simulation for the Robust Design of RF-MEMS Switches
2004 · Zhengfang Qian, Joe Tomase, et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 9
Effect of Voids on Thermo-Mechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation
2005 · Leila Jannesari Ladani, Abhijit Dasgupta · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 8
Numerical Evaluation on the Heat Dissipation Capability of Liquid Metal Based Chip Cooling Device
2005 · Zhong-Shan Deng, Jing Liu · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 8
Works count: 293
Citation count: 891
H-index: 16
I10-index: 22
2yr mean citedness:
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