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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

ISSN: 2766-8401
Source type: conference
Alternate names: Electronic Components and Technology Conference, 1991 Proceedings 41st Electronic Components & Technology Conference, 1992 Proceedings 42nd Electronic Components & Technology Conference, 40th Conference Proceedings on Electronic Components and Technology, Electronic Components and Technology Conference (ECTC), IEEE Electronic Components and Technology Conference (ECTC)
Fully OA: No
DOAJ: No
OpenAlex ID: S4363608088
Effect of simulation methodology on solder joint crack growth correlation
2002 · R. Darveaux · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 545
Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation
2003 · A. Schubert, R. Dudek, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 391
Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect
2016 · Ravi Mahajan, Robert Sankman, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 371
Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints
2004 · A. Syed · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 359
InFO (Wafer Level Integrated Fan-Out) Technology
2016 · Chien-Fu Tseng, Chung-Shi Liu, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 278
Effect of thermal aging on board level drop reliability for Pb-free BGA packages
2004 · Tz-Cheng Chiu, Kejun Zeng, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 248
3D silicon integration
2008 · J.U. Knickerbocker, P.S. Andry, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 234
Thermo-mechanical reliability of 3-D ICs containing through silicon vias
2009 · Kuan H. Lu, Xuefeng Zhang, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 211
Thermal management of 3D IC integration with TSV (through silicon via)
2009 · John H. Lau, Tang Gong Yue · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 191
System on Integrated Chips (SoIC(TM) for 3D Heterogeneous Integration
2019 · Ming-Fa Chen, Fang-Cheng Chen, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 186
Advanced reliability study of TSV interposers and interconnects for the 28nm technology FPGA
2011 · Bahareh Banijamali, Suresh Ramalingam, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 182
An Embedded Device Technology Based on a Molded Reconfigured Wafer
2006 · M. Brunnbauer, E. Furgut, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 175
Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)
2009 · Xi Liu, Qiao Chen, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 173
Development and Evaluation of 3-D SiP with Vertically Interconnected Through Silicon Vias (TSV)
2007 · Dong Min Jang, Chunghyun Ryu, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 160
Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact
2004 · Tong Yan Tee, Jing-en Luan, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 160
Silicon interposer with TSVs (Through Silicon Vias) and fine multilayer wiring
2008 · Masahiro Sunohara, Takayuki Tokunaga, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 157
The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints
2007 · Hongtao Ma, Jeffrey C. Suhling, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 154
Reliability of the Aging Lead Free Solder Joint
2006 · Hongtao Ma, J.C. Suhling, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 153
3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
2010 · Michael Topper, Ivan Ndip, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 151
TSV manufacturing yield and hidden costs for 3D IC integration
2010 · John H. Lau · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 149
Development of new 2.5D package with novel integrated organic interposer substrate with ultra-fine wiring and high density bumps
2014 · Kiyoshi Oi, Satoshi Otake, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 148
The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging
2002 · E.H. Wong, K.C. Chan, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 148
An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer
2016 · Chang-Chi Lee, Cp Hung, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 142
Assembly and reliability challenges in 3D integration of 28nm FPGA die on a large high density 65nm passive interposer
2012 · Raghunandan Chaware, Kumar Nagarajan, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 142
Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints
2001 · S. Wiese, A. Schubert, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 135
Works count: 10,830
Citation count: 102,700
H-index: 84
I10-index: 3,148
2yr mean citedness: 2.415
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