Electronic Packaging and Soldering Technologies
Topics
Description: This cluster of papers focuses on the advances and challenges in the use of lead-free solders, interfacial reactions between solders and base materials, reliability studies in electronic packaging, hi... more
Related topics (siblings) 3D IC and TSV technologies, Advanced Battery Materials and Technologies, Advanced battery technologies research, Advanced Data and IoT Technologies, Advanced DC-DC Converters +111 more
Subfield (parent): Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Works count: 57,660
Citations count: 532,300
Tensile properties of fibre-reinforced metals: Copper/tungsten and copper/molybdenum
1965 · Anthony Kelly, W. R. Tyson · Journal of the Mechanics and Physics of Solids
Lead-free Solders in Microelectronics
2000 · Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2002 · Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports