Work

Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach

Year: 1997

Type: book

Authors: Pradeep Lall, Michael Pecht, Edward B. Hakim

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1255792877

FWCI: 2.169

Cites:

Cited by: 137

Related to: 10