Cross-sectional Observation of Ni-P/Cu Multilayer Films and their Dependence of Wear Resistance with Ni-P/Cu Thickness
Year: 2013
Type: article
Abstract: Several Ni-P/Cu multilayer films of various thicknesses were formed on polycrystalline copper substrates using electrodeposition in a single bath. The Ni-P/Cu bilayer films which were thinner than 50 nm exhibited higher wear resistance than that of a Ni-P single layer. The wear loss of the films decreased concomitantly with increasing Ni-P layer ratio in the Ni-P/Cu bilayer.
DOI: 10.4139/sfj.64.605
Authors: Keisuke IZAWA, Shingo KANEKO, Yoshiyuki MOCHIDA, Govindachetty SARAVANAN, Arockiam John JEEVAGAN, Genki KOBAYASHI, Yuichi SATO, Futoshi MATSUMOTO
Institution: Kanagawa University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W1488794017