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Highlights of the DARPA eletrically conductive adhesive FCA project. Quarterly report, April 1, 1996--June 30, 1996

Year: 1996

Type: report

Abstract: The accomplishments are broken down into three different categories: materials development (polymer metal composite with increased bond strength), process development (reliability testing, bonding optimization evaluation, testing of bulk conductive adhesives, paste deposition process development), and equipment development (laboratory bonding equipment, cost estimation for flip chip attach methods).

DOI: 10.2172/266770

Authors: R Saraf, J Roldan, C Sambucetti, M Gaynes, C Woychik, M Snyder

Institutions: IBM (United States), IBM Research - Thomas J. Watson Research Center

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: green

OpenAlex ID: W1499677006

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