Work

Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode

Year: 2013

Type: conference-paper

Source: Ghent University Academic Bibliography (Ghent University)

Authors: Vandevelde, Bart, Van Kerckhove, Matthias, Degryse, Dominiek, D'Haese, Wim, Schaubroeck, David, Allaert, Bart, Geerinckx, Eddy, Lauwaert, Ralph, Willems, Geert

Institutions: IMEC, Ghent University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1505116766

FWCI:

Cites: 2

Cited by:

Related to: 10