Work

Insulated metal substrates improve in performance and product implementation

Year: 2003

Type: conference-paper

Source: Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition

DOI: 10.1109/apec.1992.228352

Authors: I. Fishbein, N.M. Abramowitz

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W1511069660

FWCI:

Cites:

Cited by: 9

Related to: 10