Work

Copper ribbon bonding for power electronics applications

Year: 2014

Type: conference-paper

Source: Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)

Authors: Norman Marenco, Magdalena Kontek, Wolfgang Reinert, Jan Lingner, Max-Hermann Poech

Institution: Fraunhofer Institute for Silicon Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Industry, innovation and infrastructure, Affordable and clean energy

Open Access status: closed

OpenAlex ID: W1525330611

FWCI: 1.204

Cites:

Cited by: 20

Related to: 10